Detection method and detection device of wafer test machine

A wafer testing and machine technology, which is applied in fault hardware testing methods, faulty computer hardware detection, error detection/correction, etc. time, the effect of reducing the error

Pending Publication Date: 2022-05-10
CHANGXIN MEMORY TECH INC
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] At present, the detection process of abnormal wafer testing machine takes a long time, and the detection accuracy is also low

Method used

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  • Detection method and detection device of wafer test machine
  • Detection method and detection device of wafer test machine
  • Detection method and detection device of wafer test machine

Examples

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Embodiment Construction

[0052]Example embodiments will now be described more fully with reference to the accompanying drawings. Example embodiments may, however, be embodied in many forms and should not be construed as limited to the examples set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of example embodiments to those skilled in the art. The described features, structures, or characteristics may be combined in any suitable manner in one or more embodiments. In the following description, numerous specific details are provided in order to give a thorough understanding of embodiments of the present disclosure.

[0053] The described features, structures, or characteristics may be combined in any suitable manner in one or more embodiments. In the following description, numerous specific details are provided in order to give a thorough understanding of embodiments of the present disclosure. However, one...

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Abstract

The invention relates to the technical field of wafer testing, in particular to a detection method and a detection device of a wafer testing machine. The detection method comprises the following steps: storing original test data tested by a plurality of wafer test machines into a database; screening target test data from the original test data according to a preset screening condition; counting the screened target test data so as to distinguish a contrast machine table and a machine table to be detected in the plurality of wafer test machine tables; comparing whether the target test data of each to-be-detected machine under the corresponding test item and the target test data of the contrast machine under the same test item have significant difference in a first preset number of days, and counting the number of days in which each to-be-detected machine has significant difference; and marking each to-be-detected machine according to the counted number of days in which each to-be-detected machine has significant difference. According to the detection method, the detection of the test machine can be automatically completed, the time consumption of the detection process is shortened, and the accuracy of the detection result is also improved.

Description

technical field [0001] The present disclosure relates to the technical field of wafer testing, and in particular to a detection method and detection device for a wafer test machine. Background technique [0002] After the wafer production is completed, the wafers are randomly assigned to different testing machines for CP testing (Circuit Probing; wafer testing) and FT testing (Final Testing; finished product testing), and record the performance of each wafer in CP testing and FT testing. All parameters in the test. By making statistics on the recorded parameter values, abnormal test machines can be detected, thereby helping engineers to check and maintain corresponding test machines. [0003] At present, the detection process of the abnormal wafer testing machine takes a long time, and the detection accuracy is also low. [0004] The above information disclosed in this Background section is only for enhancement of understanding of the background of the disclosure and there...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F11/22
CPCG06F11/2205G06F11/2273G06F11/2247
Inventor 王世生
Owner CHANGXIN MEMORY TECH INC
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