Method to prevent damage to probe card
a technology of probe cards and protection methods, applied in the field of probe cards, can solve the problems of not disclosing the protection methods or apparatus of the probe wafer, the inability to carry the current-regulating structure of the probe card, and the need for high-speed and accurate testing
Inactive Publication Date: 2006-06-01
BYRD PHILLIP E
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Benefits of technology
The solution effectively prevents damage from high test temperatures, electrical overloads, and operator errors, enabling cost savings by allowing the reuse of probe cards and ensuring reliable IC testing without risk of damage.
Problems solved by technology
Also, as IC devices become more complex, the need for high-speed and accurate testing becomes increasingly important.
Yamamoto, however, does not disclose methods or apparatus for protection of the probe wafer and further does not describe a probe card configured to carry the current-regulating structures.
The delivery of excessive voltage during probe testing to an IC may also result in damage to the probe card.
Each of these patent applications, however, is drawn to means for preventing seizing and fusing of a probe needle routed to ground and power and does not address the limitation of current through the probe card in general or through any probe needle which might otherwise cause that probe needle to become nonfunctional.
The apparatus disclosed therein, however, is relatively bulky in that the fuses are vertically disposed over the probe card and the apparatus includes a fuse body for holding the fuses.
Method used
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[0032] As noted throughout the disclosure, the present invention provides various advantages, including the ability to perform a multitude of tests, such as functional, parametric, burn-in, high frequency, and other tests, without risk of damage to the probe card. Performing IC testing according to the present invention provides significant cost savings in protecting and allowing reuse of probe cards which might otherwise be damaged by high test temperatures, electrical overloads, and various other sources of electrical failure or operator error during the testing process.
[0033] As used herein, use of the term “IC testing” encompasses both static testing, where the IC is simply powered up and dynamic testing, where the IC is powered up and is sent signals exercising some degree of functionality over the IC.
[0034] Referring to drawing FIG. 1, an exemplary probe card 30 configured in accordance with an embodiment of the present invention is shown in a schematic view. As described in...
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Probe cards are configured with protective circuitry suitable for use in electrical testing of semiconductor dice without damage to the probe cards. Protective fuses are provided in electrical communication with conductive traces and probe elements (e.g., probe needles) of a probe card. The fuses may be active or passive fuses and are preferably self-resetting, repairable, and / or replaceable. Typically, the fuses will be interposed in, or located adjacent to, conductive traces residing over a surface of the probe card. Methods of fabricating a probe card are provided, as well as various probe card configurations. A semiconductor die testing system using the probe card is also provided.
Description
CROSS-REFERENCE TO RELATED APPLICATIONS [0001] This application is a divisional of application Ser. No. 11 / 138,920, filed May 26, 2005, pending, which is a divisional of application Ser. No. 09 / 888,689 filed Jun. 25, 2001, pending.BACKGROUND OF THE INVENTION [0002] 1. Field of the Invention [0003] The present invention relates generally to probe cards for testing the electric characteristics of semiconductor dice. More specifically, the present invention relates to probe cards configured with protective circuitry suitable for use in electrical testing of semiconductor dice without damage to the probe cards. [0004] 2. Background of the Invention [0005] In the manufacture of semiconductor devices, a large number of semiconductor devices, also known as dice or integrated circuit chips (ICs or chips), are formed on a semiconductor wafer by using, for example, precision photolithographic technologies. These fabricated semiconductor devices are subjected to a series of test procedures in ...
Claims
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IPC IPC(8): G01R31/28G01R1/073H05K1/00
CPCG01R1/06766Y10T29/49147G01R3/00G01R31/2886H05K1/0293H05K1/09H05K1/167H05K2201/068H05K2201/10053H05K2201/10181Y10T29/49139Y10T29/4913Y10T29/49117Y10T29/49107Y10T29/49204Y10T29/49005Y10T29/49155Y10T29/49004Y10T29/49126G01R1/07371G01R1/36
InventorBYRD, PHILLIP E.
OwnerBYRD PHILLIP E