Cooling-fan-free system module

Abstract

A cooling-fan-free system module includes a housing unit having a front and a rear case together defining a receiving space therebetween, and the rear case being highly thermal-conductive; a circuit module received in the receiving space of the housing unit and including a circuit board having at least one heat-producing element electrically connected thereto; a heat radiating unit including a heat-conducting pad raised from an inner side of the rear case corresponding to the heat-producing element for transferring heat produced by the heat-producing element to the rear case, and at least one fin-like heat radiating member integrally formed on a back side of the rear case; and a tightening unit including at least two sets of internally threaded posts, screw fasteners, and elastic elements to ensure tight and good contact of the heat-conducting pad with the heat-producing element.

Description

RELATED APPLICATIONS[0001]This application claims priority to Taiwan Application Serial Number 96206389, filed Apr. 20, 2007, which is herein incorporated by reference.FIELD OF THE INVENTION[0002]The present invention relates to a cooling-fan-free system module, and more particularly to a system module provided with heat radiating unit and employing thermal convection and thermal transmission to achieve good heat radiating effect.BACKGROUND OF THE INVENTION[0003]The currently available system module usually includes a housing and a circuit module provided in the housing. The circuit module consists of a mainboard, and a plurality of electronic elements mounted on the main board, such as a central processing unit (CPU), a hard disk, a memory, and integrated circuits (IC's).[0004]Since the electronic elements produce heat during operation thereof, vents and cooling fans are normally provided on the system module at proper positions corresponding to the heat-producing electronic elemen...

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