Cooling fin

Abstract

A cooling fin provides at least a projection part and at least a slot is disposed at lateral sides for the airflow producing turbulent flows while passing through the slot and creating eddy currents at the periphery of the cooling fin. Therefore, the cold air, which flows between a plurality of cooling fins, can stagnate longer time for carrying more heat outward and enhancing the heat dissipation efficiency greatly.

Description

BACKGROUND OF THE INVENTION[0001]1. Field of the Invention[0002]The present invention is related to a cooling fin and particularly to a cooling fin, which is capable of increasing turbulent currents and carrying out a great deal of heat source.[0003]2. Brief Description of the Related Art[0004]The processing speed of the electronic chip increases due to incessantly progress of technology but it leads to increase of the generated heat as well. Nevertheless, the high temperature is a primary reason of the undesirable operation efficiency and burn-out of the chip. Therefore, how to dissipate the heat from the chip for protecting the chip is one of the subjects that are researched and developed currently.[0005]In order to obtain the best effect of heat dissipation and promote the heat dissipation efficiency, most researches and developments are focus on the increased conductive area for the heat transmitted by the heat sink and the fan mounted to the heat sink for forcing the airflow. B...

AI Technical Summary

Benefits of technology

[0006]In order to overcome the deficiencies of the prior art, an object of the present invention is to provide a cooling fin, which get involve the concept of turbulent flow for increasing the stagnation time of the air staying at the respective cooling fin of the cooling fin set and enhancing the efficiency of heat dissipation greatly in addition to increase the area of the heat dissipation.

[0007]Accordingly, A cooling fin according to the present invention comprises at least a projection part and a slot, which is disposed at the lateral sides, for turning the airflow into the turbulent flow while the air flow passing through the slot and for creating eddy currents at the periphery of the cooling fin. Therefore, the cold air, which flows between a plurality of cooling fins, can stagnate longer time for carrying more heat outward and enhancing the heat dissipation efficiency greatly.

[0008]Wherein, the protrusion part can be circular or the square shape. Further, a plurality of the protrusion parts can be arranged irregularly on the plate member such that the effect of different eddy currents at the periphery of the cooling fin can be produced advantageously and the slots at the lateral sides of the respective protrusion part are helpful for increasing the coefficient of heat exchange of the cooling fin and enhancing the integral performance of the cooling fin.

Problems solved by technology

The processing speed of the electronic chip increases due to incessantly progress of technology but it leads to increase of the generated heat as well.

Nevertheless, the high temperature is a primary reason of the undesirable operation efficiency and burn-out of the chip.

Hence, the effect of heat dissipation is still limited although it was designed for expecting the good heat transfer with the effective heat dissipation.

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