The production method of molybdenum target
A production method and molybdenum target technology, which are applied in metal material coating process, ion implantation plating, coating and other directions, can solve the problems of inability to meet sputtering requirements, many internal pores, and blank cracking.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Publication Date
- 2017-06-30
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Abstract
Description
technical field
[0001] The invention relates to the field of semiconductor manufacturing, in particular to a method for manufacturing a molybdenum target. Background technique
[0002] Molybdenum is a silver-white metal, hard and tough, with a melting point of 2617°C and a boiling point of 4612°C. Molybdenum has good corrosion resistance and stability at room temperature, as well as low specific impedance, good electrical conductivity and good thermal expansion properties. Therefore, molybdenum is widely used in industries such as aerospace industry, electronics industry, glass manufacturing industry and solar photovoltaic industry.
[0003] In the field of liquid crystal display (abbreviation, LCD) manufacturing in the electronics industry. Compared with traditional chromium wiring, molybdenum wiring can more effectively reduce the specific impedance and film stress of wiring, so molybdenum used in LCD components can effectively improve the brightness, contrast, color and...
Examples
Embodiment Construction
[0041] As mentioned in the background art, the large-sized molybdenum target obtained by the existing molybdenum target preparation process has low density and cannot meet the requirements of target sputtering. For this reason, the invention provides a method for making a molybdenum target. The molybdenum target material production method provided by the invention can prepare a large-sized molybdenum target material with a density as high as 99.94%, an average grain size of the molybdenum target material less than 50 μm, and a uniform grain structure. It fully meets the requirements of magnetron sputtering for large-size molybdenum targets.
[0042] The technical solutions of the present invention will be clearly and completely described below through specific embodiments in conjunction with the accompanying drawings.
[0043] First, refer to figure 1 As shown, step S1 is executed to provide molybdenum powder.
[0044] In this embodiment, the purity of the molybdenum powder...