Lighting device

Abstract

The invention discloses a luminous device, which comprises the following parts: base, first metal layer, at least one luminous element and insulating layer, wherein the first metal layer lies on the base; the insulating layer is set on the first metal layer with luminous element on the insulating layer.

Description

technical field [0001] The invention relates to a light emitting device, in particular to a light emitting device with good heat dissipation performance. Background technique [0002] With the development of the optoelectronic industry, light-emitting elements such as light-emitting diodes (LEDs) have been widely used in display applications of various electronic products. [0003] Please refer to figure 1 As shown, a conventional LED light-emitting device 1 is provided with an insulating layer 11 on a substrate 10, and a plurality of LED light-emitting elements 12 are arranged on the insulating layer 11, and then connected to the insulating layer 11 by wire bonding. A metal layer 13 above forms an electrical connection, and finally the LED light-emitting elements 12 are covered with an encapsulation layer 14 to protect the light-emitting elements 12 from being damaged by mechanical, heat, moisture or other factors. [0004] With the development of high efficiency and high...

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Problems solved by technology

[0004] With the development of high efficiency and high brightness of the light-emitting device 1, the light-emitting element 12 will dissipate heat during operation, and the accumulated heat will increase the temperature and cause adverse effects on the luminous efficiency and service life of the light-emitting element 12

However, the conventional light-emitting element 12 is disposed on the insulating layer 11 with poor heat dissipation, and the airtight packaging of the encapsulation layer 14 makes it difficult for the heat emitted by the light-emitting element 12 to dissipate, so the problem of difficult heat dissipation becomes more obvious.

[0005] In order to solve the problem of heat dissipation, the conventional technology uses high thermal conductivity materials such as ceramic materials, copper, copper alloy or high thermal conductivity materials to form the substrate 10, and the insulating layer 11 is generally connected to the substrate 10 with a thermally conductive adhesive. However, due to thermal conductivity The heat conduction efficiency of the glue material is not good, so the heat dissipation performance will still be affected due to the problem of thermal resistance, and the deterioration of the glue material will also affect the life of the light emitting device 1

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