Double-layer ring die in interference fit connection for biomass particle granulator
A biomass granule and granulator technology, applied in the direction of extrusion granulation of molds, etc., can solve the problems of limited reinforcement effect, large load bearing, ring die breakage, etc. Effect
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Embodiment 1
[0053] Such as figure 1 , the double-layer ring die with interference connection for the biomass granulator of the present invention adopts a hoop-type structure. That is, the radial dimension at both ends of the outer ring sleeve 2 is larger than the radial size of the area where the outer mold hole 4 is provided on the outer ring sleeve 2 .
[0054] The cylindrical mating surface between the inner ring die 1 and the outer ring sleeve 2 not only covers the part of the inner ring die 1 with the inner die hole 3 in the axial direction, but also covers the area other than the inner die hole 3 .
Embodiment 2
[0056] Such as figure 2 , the double-layer ring die with interference connection for the biomass granulator of the present invention adopts another structure of hoop type. The inner ring die 1 and the outer ring sleeve 2 respectively have two sections of interference joint surfaces with different diameters, which are stepped. The interference between the contact surfaces of two sections of cylinders is the same interference or different interference.
[0057] The cylindrical mating surface between the inner ring die 1 and the outer ring sleeve 2 not only covers the part of the inner ring die 1 with the inner die hole 3 in the axial direction, but also covers the area other than the inner die hole 3 .
Embodiment 3
[0059] Such as image 3 , The double-layer ring die with interference connection for the biomass granulator of the present invention adopts a flange structure. That is, the width of the outer ring sleeve 2 is smaller than the width of the inner ring die 1 .
[0060] The cylindrical mating surface between the inner ring die 1 and the outer ring sleeve 2 only covers the part of the inner ring die 1 with the inner die hole 3 in the axial direction, and does not cover the area other than the inner die hole 3 .
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