Transplanting method of multiplex circuit board

A technology for circuit boards and good products, applied in the field of transplanting multi-connection circuit boards, can solve the problems of limited practicability, increasing the complexity of the manufacturing process, affecting the accuracy of recombination and bonding, and the reliability of the manufacturing process.

CN101557680AInactive Publication Date: 2009-10-14UNIMICRON TECH CORP
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Patent Information

Authority / Receiving Office
CN · China
Current Assignee / Owner
Publication Date
2009-10-14
Estimated Expiration
Not applicable · inactive patent

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Abstract

The invention discloses a transplanting method of multiplex circuit boards, comprising the following steps: measuring the size of the multiplex circuit board of each batch number; sorting the multiplex circuit boards of different expansion-contraction levels through the statistical analysis of the measured data; selecting the multiplex circuit board of one level and cutting the multiplex circuit board to remove at least one poor circuit board to form a vacant position; selecting at least one good circuit board of same level, and reassembling and jointing the good circuit board to transplant the good circuit board to the vacant position, thereby the reassembled and jointed multiplex circuit boards have higher precision.
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Description

technical field

[0001] The invention relates to a multi-connection circuit board, in particular to a method for transplanting a multi-connection circuit board. Background technique

[0002] At present, the manufacturing method of multi-circuit board is usually to make a printed circuit board (PCB panel) into multiple sub-circuit boards, so that the printed circuit board forms a multi-circuit board with 4, 6 or more sub-circuit boards. However, since the probability of defective products produced by these sub-circuit boards is about 5% to 7%, it would be a waste of resources if the defective products are discarded. Therefore, manufacturers of multi-connected circuit boards usually use The good product circuit board is removed as a spare circuit board, and then the spare circuit board is used to replace the damaged bad circuit board on other multi-connected circuit boards, so that all sub-circuit boards on the reorganized multi-connected circuit board are usable good products ...

Examples

Embodiment Construction

[0031] figure 1 is an exploded schematic diagram of a multi-circuit board applied to an embodiment of the present invention, and figure 2 yes figure 1 Schematic diagram of the recombination of the multi-circuit board. Please refer to figure 1 , the multi-connected circuit board 100 is made of a large-area printed circuit board, which includes a plurality of sub-circuit boards 110 and a plurality of positioning holes 120, and the good-quality circuit board 130 is, for example, a sub-circuit cut from another multi-connected circuit board The board may be a good product of the same type or a different type from the sub-circuit board 110 on the multi-connection circuit board 100 . When a sub-circuit board on the multi-connection circuit board 100 is a defective product or needs to be replaced with a sub-circuit board of a different type, the transplantation method that can be adopted is to cut with a CNC processing machine to remove at least one sub-circuit board, and then Th...