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Three-dimensional wafer-level packaging structure of oscillator

A wafer-level packaging and vibrator technology, applied in electrical components, impedance networks, etc., can solve the problems of high cost and large packaging structure, and achieve the effect of reducing size, production cost, and parasitic capacitance/inductance effect.

Active Publication Date: 2012-05-09
台晶(宁波)电子有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0007] The technical problem to be solved by the present invention is to provide a three-dimensional wafer-level packaging structure for a vibrator device, achieve highly integrated system-level packaging, realize a complete solution for a single chip, and overcome the problems of excessive packaging structure and high cost

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  • Three-dimensional wafer-level packaging structure of oscillator
  • Three-dimensional wafer-level packaging structure of oscillator
  • Three-dimensional wafer-level packaging structure of oscillator

Examples

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Embodiment Construction

[0026] Below in conjunction with specific embodiment, further illustrate the present invention. It should be understood that these examples are only used to illustrate the present invention and are not intended to limit the scope of the present invention. In addition, it should be understood that after reading the teachings of the present invention, those skilled in the art can make various changes or modifications to the present invention, and these equivalent forms also fall within the scope defined by the appended claims of the present application.

[0027] Embodiments of the present invention relate to a three-dimensional wafer-level packaging structure of a vibrator device, figure 1 Shown is a schematic structural diagram of the three-dimensional wafer-level packaging structure of the vibrator device according to the first embodiment of the present invention.

[0028] The three-dimensional wafer-level packaging structure disclosed in the present invention includes a vibr...

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Abstract

The invention relates to a three-dimensional wafer-level packaging structure of an oscillator, which comprises an upper cover, an oscillator unit, at least one functional integrated circuit chip and a packaging ring, wherein the packaging ring is arranged on the edge(s) of the functional integrated circuit chip(s) for combining with the upper cover and hermetically packaging the oscillator unit on the functional integrated circuit chip(s). The oscillator unit and the functional integrated circuit chip(s) adopt vertical piling three-dimensional wafer-level packaging, thereby achieving the package with high integration, reducing the noble metal materials and further shortening the size, and reducing the parasitic capacitance / inductance effect derived from high frequency.

Description

technical field [0001] The invention relates to the field of vibrator devices, in particular to a three-dimensional wafer-level packaging structure of a vibrator device used in various electronic products such as mobile phones, notebook computers, and automotive electronics. Background technique [0002] Quartz components have stable piezoelectric characteristics and can provide precise and wide reference frequency, frequency control, timing function and noise filtering functions. In addition, quartz components can also be used as motion and pressure sensors, as well as important optical components; therefore , for electronic products, quartz components play a pivotal role. [0003] For the packaging of quartz oscillator crystals, the previous case proposed many solutions, such as the US Patent No. 6531807 patent "Piezoelectric Device" (Piezoelectric Device), which is mainly aimed at the ceramic base in different regions. Quartz oscillator and oscillator circuit chip The pa...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H03H9/21
Inventor 赵岷江黄国瑞
Owner 台晶(宁波)电子有限公司
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