Eureka AIR delivers breakthrough ideas for toughest innovation challenges, trusted by R&D personnel around the world.

Substrate for light emitting element, method for manufacturing same, and light emitting device

A light-emitting element and manufacturing method technology, applied in the direction of electrical components, electric solid-state devices, semiconductor devices, etc., can solve the problems of increasing the overall size, difficulty in coping with the miniaturization of LED products, etc., and achieve the effect of improving heat dissipation

Inactive Publication Date: 2012-09-26
PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTD
View PDF9 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In other words, as a result, the overall size of the package increases due to the presence of the Zener diode element 270, making it difficult to cope with further miniaturization of LED products.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Substrate for light emitting element, method for manufacturing same, and light emitting device
  • Substrate for light emitting element, method for manufacturing same, and light emitting device
  • Substrate for light emitting element, method for manufacturing same, and light emitting device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0070] Hereinafter, the substrate for a light-emitting element of the present invention and its manufacturing method will be described in detail. In addition, the light-emitting device of the present invention will be described along with this description. In addition, various elements shown in the drawings are merely schematically shown for understanding the present invention, and dimensional ratios, appearances, and the like may be different from actual ones.

[0071] [Substrate for light-emitting element of the present invention]

[0072] In the light-emitting element substrate of the present invention, a voltage-dependent resistive layer is embedded as a protective element in a region of the substrate overlapping with a mounted light-emitting element. That is, if figure 1 As shown, in the light-emitting element substrate 100 of the present invention, the voltage-dependent resistor layer 50 as a protective element is embedded in the light-emitting element mounting region...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

Disclosed is a substrate for a light emitting element, which has one of the two facing main surfaces as a mounting surface, and has the light emitting element mounted on the mounting surface. The substrate for the light emitting element is provided with a protection element for the light emitting element, said protection element including a voltage-dependent resistance layer embedded in a substrate body, and a first electrode and a second electrode connected to the voltage-dependent resistance layer. The light emitting element is mounted such that the light emitting element overlaps the voltage-dependent resistance layer.

Description

technical field [0001] The present invention relates to a substrate for a light-emitting element and a manufacturing method thereof. More specifically, the present invention relates to a substrate for a light-emitting element on which a light-emitting diode (hereinafter also referred to as "LED") is mounted, and a method for manufacturing the substrate. Furthermore, the present invention relates to a light emitting device configured by mounting a light emitting element on a light emitting element substrate. Background technique [0002] In recent years, LEDs as light sources have been used in various applications due to their advantages of energy saving and long life. In particular, recently, the luminous efficiency of LEDs has been improved in high-intensity applications, and LEDs have begun to be used in lighting applications. [0003] In lighting applications of white LEDs, the amount of light can be increased by increasing the current applied to the LEDs. However, und...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/62H01L33/64
CPCH01L33/54H01L2924/0002H01L33/486H01L33/641H01L25/167H01L2924/09701H01L2933/0033H01L2924/00
Inventor 中谷诚一小川立夫木村一夫濑川茂俊
Owner PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Eureka Blog
Learn More
PatSnap group products