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COF (chip on film) base band, manufacturing method of COF base band, liquid crystal display module

A technology of liquid crystal display module and manufacturing method, which is applied in semiconductor/solid-state device manufacturing, optics, instruments, etc., can solve problems such as difficulty in confirming liquid crystal glass marks, low COF edge strength, and COF edge peeling, so as to improve alignment Accuracy and operability, prevention of edge peeling, effects of process cost reduction

Active Publication Date: 2013-01-23
TCL CHINA STAR OPTOELECTRONICS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] 1. The strength of the COF edge is low, and the phenomenon of COF edge peeling and warping often occurs;
[0006] 2. The surface of the alignment mark 91 is covered with copper, which makes it difficult to confirm the mark on the liquid crystal glass, resulting in difficulty in alignment

Method used

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  • COF (chip on film) base band, manufacturing method of COF base band, liquid crystal display module
  • COF (chip on film) base band, manufacturing method of COF base band, liquid crystal display module
  • COF (chip on film) base band, manufacturing method of COF base band, liquid crystal display module

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Embodiment Construction

[0032] Preferred embodiments of the present invention will be described below with reference to the accompanying drawings.

[0033] Please combine figure 1 and figure 2 Shown is the first embodiment of the COF baseband of the present invention.

[0034] The COF baseband 1 of this embodiment is mainly composed of connecting pins 11 , a circuit chip 12 , and input wiring (not shown) and output wiring (not shown) respectively connected to the connecting pins 11 and the circuit chip 12 .

[0035] see figure 1 , is a schematic structural diagram of the COF baseband of the embodiment of the present invention, wherein:

[0036] The connecting pins 11 are arranged at the upper and lower ends of the COF baseband as shown in the figure, and they may be the input terminals of the COF baseband or the output terminals of the COF baseband in actual implementation.

[0037] The connecting pins 11 are respectively connected to the circuit chip 12 arranged in the middle of the COF baseb...

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Abstract

The invention discloses a COF (chip on film) base band. The COF base band at least comprises a connection pin and aligning marks, wherein the connection pin is used for connecting a connection terminal arranged on a liquid crystal glass; the aligning marks are respectively arranged at the two sides of the connection pin and are used for coincidence aligning with marks arranged on the connection terminal; and the area in which the aligning marks are located is pervious to light. The invention further discloses a manufacturing method for manufacturing the COF base band and a liquid crystal display module. With the adoption of the COF base band, the manufacturing method of the COF base band and the liquid crystal display module, the edge strength of the COF base band is enhanced, and the aligning accuracy and the operability of the joint of the COF base band and the liquid crystal glass are improved. The process materials can be saved and the process cost is lowered.

Description

technical field [0001] The invention relates to the field of liquid crystal display, in particular to a COF baseband, a manufacturing method thereof, and a liquid crystal display module. Background technique [0002] COF (Chip On Film, chip soft film packaging technology) is widely used in the field of liquid crystal display. The COF baseband is usually mounted on a driver of a liquid crystal display device for driving the liquid crystal display device. [0003] Since COF bonding to liquid crystal glass requires high-density bonding, it is necessary to set alignment marks on both sides of the connection between COF and liquid crystal glass to confirm whether the COF base tape has been accurately aligned with the liquid crystal glass. [0004] like Image 6 Shown is a schematic structural diagram of the COF baseband in the prior art. The existing COF base tape 9 usually uses the copper layer as the alignment mark. The problems of the COF base tape with this structure are: ...

Claims

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Application Information

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IPC IPC(8): G02F1/13H01L23/498H01L23/544H01L21/48
CPCG02F1/1341H01L23/4985H01L23/544H01L2223/5442H01L2223/54426H01L2223/54486H01L2924/0002H01L2924/0001H01L2924/00
Inventor 阙成文李德华
Owner TCL CHINA STAR OPTOELECTRONICS TECH CO LTD