A method for improving the machining accuracy of holes in ultra-long high-frequency circuit boards

Abstract

The invention discloses a method for improving overlength high frequency circuit board hole site working accuracy. Through an interactive design of subsection drill holes and locating holes, the continuity and the consistency of a front section of drill holes and a rear section of drill holes are ensured, and the problems of dislocation, offset and the like are solved; an original mechanical plate grinding method is replaced with a chemical microetching method, so that the problem that the hole site accuracy is reduced caused by tensile deformation of panels is eliminated; and through baking before processing a circuit board and a finished product is delivered, so that the humidity in the board is effectively removed, the coefficient of thermal expansion of the panels is stabilized, and the problem of accuracy variation caused by deformation or tortuosity of the panels is solved. According to the method for improving overlength high frequency circuit board hole site working accuracy, the drilling accuracy of the overlength high frequency circuit board is effectively improved, the problems of disability in assembly, and severe signal interference caused by severe hole shift in an earlier stage are solved, the percent of pass of the overlength high frequency circuit board is improved, meanwhile, the product quality of enterprises is promoted, and the scrapping of products is reduced.

Description

technical field [0001] The invention belongs to the technical field of printed circuit board production, and specifically relates to a method for improving the machining accuracy of hole positions of ultra-long and high-frequency circuit boards. Background technique [0002] With the rapid development of wireless network and satellite communication technology, information products and electronic equipment are gradually becoming high-frequency, and the development of a new generation of information electronic products requires high-frequency circuit boards, such as satellite systems, mobile phone receiving base stations and other communication products must use High frequency circuit board. [0003] With the widespread use of 3G communication technology and the expansion of 4G communication technology pilots, higher requirements are put forward for the use of high-frequency circuit boards, so ultra-long high-frequency circuit boards are gradually being widely used. Ultra-lon...

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Problems solved by technology

[0009] Therefore, the object of the present invention is to provide a method for improving the machining accuracy of ultra-long and high-frequency circuit board holes, so as to solve the defects of scattered positioning holes and fool-proof design during the processing of ultra-long and high-frequency circuits. Lead to the problem of drilling accuracy dislocation and offset in the production process

[0010] The purpose of the present invention is also to provide a method for improving the machining accuracy of ultra-long and high-frequency circuit board holes, so as to solve the problem of being affected by external forces when the copper surface is processed by mechanical brushing during the processing of ultra-long and high-frequency circuit boards. The problem that the plate is stretched will easily lead to the problem that the accuracy of the hole position will be shifted from the original basis.

[0011] The purpose of the present invention is also to provide a method for improving the processing accuracy of ultra-long and high-frequency circuit board holes, so as to solve the problem of product deformation due to the influence of moisture on the board during the processing of ultra-long and high-frequency circuit boards. The accuracy of the offset changes on the original basis

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