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Energy-ray-curable resin composition,adhesive comprising same, and cured object obtained therefrom

A technology of energy ray curing and resin composition, which is applied in the field of energy ray curable resin composition, adhesive and cured body, and can solve the problem of no storage stability

Active Publication Date: 2013-05-22
DENKA CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, there is no description about the sufficient storage stability obtained by the present invention

Method used

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  • Energy-ray-curable resin composition,adhesive comprising same, and cured object obtained therefrom
  • Energy-ray-curable resin composition,adhesive comprising same, and cured object obtained therefrom
  • Energy-ray-curable resin composition,adhesive comprising same, and cured object obtained therefrom

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1～9

[0128] The raw materials of the types shown in Table 1 were mixed at the composition ratio shown in Table 1 to prepare the resin compositions of Examples 1-9. The photocurability, tensile shear adhesive strength, and storage storage stability were evaluated as described later, and the results are shown in Table 1.

[0129]

Embodiment 10～13

[0135] The raw materials of the types shown in Table 3 were mixed at the composition ratios shown in Table 3 to prepare resin compositions of Examples 10 to 13. The results of the evaluation are shown in Table 3.

[0136] 【table 3】

[0137]

[0138] 〔Photocurability evaluation〕

[0139] The rigid modulus under UV irradiation can be measured using a rheometer ("MCR-301" manufactured by Arton-Paar Co., Ltd.). The obtained resin composition was sandwiched from both sides by a circular plate with a diameter of 8 mm, while irradiating the resin composition with UV (illuminance at 365 nm: 150 mW / cm 2 ), while measuring at 25°C (±0.5°C) and a frequency of 10Hz. Within 200 seconds after the start of UV irradiation, the storage rigidity modulus G' increased to 1.00E+4 (1.00×10 4 ) or above was judged to be good, and marked with a symbol "○". On the other hand, those whose storage rigidity modulus G' was less than 1.00E+4 within 200 seconds after the start of UV irradiation were...

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Abstract

Provided is an energy-ray-curable resin composition which satisfies curability, adhesive properties, and storage stability, characterized by comprising (A) a cationically polymerizable compound, (B) a specific cationic photopolymerization initiator, and (C) one or more antioxidants selected from the group consisting of phenolic antioxidants and quinone compound antioxidants. Also provided are a cured object obtained by curing the energy-ray-curable resin composition and an adhesive comprising the energy-ray-curable resin composition.

Description

technical field [0001] The present invention relates to an energy ray curable resin composition, an adhesive and a cured body using the composition. Background technique [0002] In recent years, in the field of electronic equipment, equipment has been developing toward higher performance. Especially in optical pickup devices used for playback and recording of optical recording media such as CDs, DVDs, Blu-ray discs corresponding to blue semiconductor lasers, and HD-DVDs, display components such as liquid crystals and organic electroluminescence, such as CCDs and CMOSs When bonding electronic components such as image sensors and element packages used in semiconductor components, if the positions of the components deviate after bonding, the operation of these electronic components will fail. Therefore, an adhesive having both high adhesion and low cure shrinkage is sought. [0003] In addition, when the base of technical glass, the fixing of the disc, and the bonding of opt...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G59/40C08F2/50C09J4/00
CPCC08L2312/06C09J4/00C08F2/50C09J163/00C08F20/00C08G59/40
Inventor 星野贵子后藤庆次粟村启之渡边淳大岛和宏依田公彦
Owner DENKA CO LTD
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