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Electronic component supply device and electronic component mounting device

A technology for the supply of electronic components and electronic components, which is applied in the direction of electrical components, electrical components, etc., can solve the problem of low supply accuracy, and achieve the effect of efficient and high-precision supply

Active Publication Date: 2017-05-17
JUKI CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the electronic component supply device, if the electronic components supplied to the holding area (holding position) are unstable, that is, the supply accuracy is low, this is one of the reasons why lead-type electronic components cannot be inserted into the substrate.

Method used

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  • Electronic component supply device and electronic component mounting device
  • Electronic component supply device and electronic component mounting device
  • Electronic component supply device and electronic component mounting device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0150] Hereinafter, the present invention will be described in detail with reference to the accompanying drawings. In addition, this invention is not limited by the form (henceforth embodiment) for carrying out the invention mentioned below. In addition, the constituent elements in the following embodiments include elements within the so-called equivalent range, such as elements that can be easily conceived by those skilled in the art, substantially the same elements, and the like. In addition, components disclosed in the following embodiments may be appropriately combined.

[0151]Hereinafter, embodiments of the electronic component mounting apparatus and electronic component mounting method according to the present invention will be described in detail based on the drawings. In addition, this invention is not limited by this embodiment. figure 1 It is a schematic diagram which shows the schematic structure of an electronic component mounting apparatus.

[0152] figure 1 ...

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PUM

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Abstract

The present invention provides an electronic part supplying device and an electric part installing device, which can supply lead-type electronic part with high efficiency and high accuracy. The electronic part supplying device and the electric part installing device are equipped with an electric part retaining belt that comprises a retaining belt main body and a plurality of radial lead-type electric parts retained on the retaining belt main body, supply the retained radial lead-type electronic parts to a retaining region, and comprise a frame body which possesses a guiding groove for guiding the electric part retaining belt; a supply unit which conveys the electric part retaining belt guided to the guiding groove along the feeding direction of the retaining belt, and a cutting-off unit which is equipped with a cutting mechanism for cutting the leads of the radial lead-type electric parts moving to the retaining region, a clamping mechanism of supporting electric parts and separating the radial lead-type electric parts and the electric parts. In the cutting-off unit, the clamping mechanism and the cutting mechanism are driven by a same power source, the clamping mechanism is used to support the electric parts, and the cutting mechanism is used to cut off the leads.

Description

technical field [0001] The present invention relates to an electronic component supply device for supplying electronic components, and an electronic component mounting device for holding and moving an electronic component with a suction nozzle and mounting the electronic component on a substrate. Background technique [0002] An electronic component mounting apparatus for mounting an electronic component on a substrate includes a mounting head having a suction nozzle, and the electronic component is held by the suction nozzle and mounted on the substrate. The electronic component mounting device moves the suction nozzle of the mounting head in a direction perpendicular to the surface of the substrate to absorb the components in the electronic component supply device, and then makes the mounting head face to face in a direction parallel to the surface of the substrate. After reaching the mounting position of the suctioned component, the suction nozzle of the mounting head mov...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K13/02H05K13/04
Inventor 小野孝喜高桥雅志谷口史之
Owner JUKI CORP