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Bowl feeder unit, bowl feeder assembly, and electronic component mounting device

A technology of electronic components and feeders, applied in the direction of electrical components, electrical components, etc., can solve the problems of low supply accuracy, limited, expensive, etc., and achieve the effect of high-efficiency, high-precision supply

Active Publication Date: 2018-03-09
JUKI CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, the types of electronic components that can be mounted corresponding to the types of mounting heads mounted on the mounting device are limited, and since there are various types of mounting heads, it becomes a very expensive device.
[0007] Here, in the electronic component supply apparatus, if the electronic components supplied to the holding area (holding position) are not stable, that is, the supply accuracy is low, this is one of the reasons why it is impossible to insert lead-type electronic components on the board.

Method used

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  • Bowl feeder unit, bowl feeder assembly, and electronic component mounting device
  • Bowl feeder unit, bowl feeder assembly, and electronic component mounting device
  • Bowl feeder unit, bowl feeder assembly, and electronic component mounting device

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Embodiment Construction

[0155] Hereinafter, the present invention will be described in detail with reference to the accompanying drawings. In addition, this invention is not limited by the form (henceforth embodiment) for carrying out the invention mentioned below. In addition, the constituent elements in the following embodiments include elements within the so-called equivalent range, such as elements that can be easily conceived by those skilled in the art, substantially the same elements, and the like. In addition, components disclosed in the following embodiments may be appropriately combined.

[0156] Hereinafter, embodiments of the electronic component mounting apparatus and electronic component mounting method according to the present invention will be described in detail based on the drawings. In addition, this invention is not limited by this embodiment. figure 1 It is a schematic diagram which shows the schematic structure of an electronic component mounting apparatus.

[0157] figure 1...

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Abstract

The present invention provides a bowl feeder unit, a bowl feeder assembly, and an electronic component mounting device capable of supplying lead-type electronic components with high efficiency and high precision. A bowl feeder unit including: a plurality of bowl feeders having storage bowls into which a plurality of electronic components are placed, and a device for guiding the electronic components discharged from the storage bowls to holding positions held by suction nozzles a guide rail, a support mechanism for blocking a downstream side of the holding position of the guide rail and supporting the electronic component at the holding position of the guide rail, and a device for detecting the electronic component moving on the guide rail a movement detection unit; a vibration unit that vibrates the storage bowl of the bowl feeder; and a control unit that controls the operation of the vibration unit based on a detection result of the movement detection unit. The operation of the vibration unit is controlled.

Description

technical field [0001] The present invention relates to a bowl feeder unit, a bowl feeder assembly, and an electronic component mounting device that holds and moves an electronic component with a suction nozzle and mounts the electronic component on a substrate. Background technique [0002] An electronic component mounting apparatus for mounting an electronic component on a substrate includes a mounting head having a suction nozzle, and the electronic component is held by the suction nozzle and mounted on the substrate. The electronic component mounting device moves the suction nozzle of the mounting head in a direction perpendicular to the surface of the substrate to absorb the components in the electronic component supply device, and then makes the mounting head face to face in a direction parallel to the surface of the substrate. After reaching the mounting position of the suctioned component, the suction nozzle of the mounting head moves in a direction perpendicular to ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K13/02H05K13/04
Inventor 加贺谷宏之高村国章高桥大志池部仁
Owner JUKI CORP