Washing device used for chemical mechanical polishing equipment

Abstract

The invention discloses a washing device used for chemical mechanical polishing equipment. The washing device is characterized by including a shell and multiple nozzles arranged at intervals and in a row, the nozzles include straight nozzles used for spraying water to wafers and bent straight nozzles used for spraying water to the inner wall of the top cover of the chemical mechanical polishing equipment, the nozzles are connected with an outside water incoming pipe through a water pipe, the straight nozzles are vertically arranged on the shell, each bent nozzle is bent to be an obtuse angle, water outlets of the bent nozzles are different in direction, and the washing device is arranged at a position adjacent to each polishing platform of the chemical mechanical polishing equipment. By the washing device, the wafers can be washed while the inner wall of the top cover of the chemical mechanical polishing equipment is washed to enable the inner wall to constantly maintain humid, so that grinding liquid sprayed on the inner wall of the top cover in the process of polishing cannot be dried and crystallize, probability that grinding liquid crystals drop down and scratch the wafers in the process of polishing is lowered, and finished product rate of polishing production is increased. The washing device is simple in structure, convenient to use and low in cost.

Description

technical field [0001] The invention relates to a cleaning device, in particular to a cleaning device for chemical mechanical polishing equipment. Background technique [0002] See attached figure 1 As shown, the chemical mechanical polishing equipment used in semiconductor production usually includes a plurality of polishing tables 10, a plurality of polishing heads are arranged above the polishing table 10, a top cover is arranged above the polishing heads, and the adjacent positions of each polishing table 10 A wafer cleaning device 11 is provided, and a wafer carrying mechanism 12 is also provided at the adjacent position of the polishing table 10, referring to the appended figure 2 And attached image 3 As shown, the wafer cleaning device 11 includes a housing 1 and a plurality of straight nozzles 21 arranged vertically at intervals on the housing 1, the water outlets of the straight nozzles 21 are directed upwards, image 3 The arrow in represents the spraying dire...

AI Technical Summary

Problems solved by technology

And existing wafer cleaning device 11 can only clean the wafer that moves to directly above it

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