Grid strain analysis method for thin plate forming and application of method

An analysis method and forming processing technology, applied in metal processing, metal processing equipment, manufacturing tools, etc., can solve the problems of high cost, difficult for ordinary personnel to fully grasp, and unable to be promoted on a large scale, and achieve the effect of easy grasp and low cost.

Inactive Publication Date: 2014-07-23
YIZHENG SHENWEI STAMPING
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Problems solved by technology

[0004] Since this method is obtained by electrochemical etching or photolithographic chemical etching of the circular grid lines on the plate, although the precision is high, the cost is high, the operation process is complicated, and the cost is high. It is difficult for ordinary pe

Method used

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  • Grid strain analysis method for thin plate forming and application of method
  • Grid strain analysis method for thin plate forming and application of method
  • Grid strain analysis method for thin plate forming and application of method

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[0045] 1. Mesh strain analysis method for sheet forming processing:

[0046] figure 1 It is a general metal sheet under undeformed no-load (no external force) conditions. The material is marked with l 0 ×l 0 Squares to measure the deformation of the material. For simplicity, l 0 ×l 0 The grid has no specific positioning. It should be mentioned that the strain in the thickness direction is neglected during processing due to the simplification. The strain in the thickness direction can be calculated based on the strain on the measured surface by assuming that the volume remains unchanged during the deformation process.

[0047] figure 2 Indicates the tensile force F of the above metal plate in the A-A direction A The deformed situation. Obviously the metal plate will pull in force F A Stretches in the direction of, the side length of the strained metal plate surface becomes l A (Such as figure 2 Shown by the solid line), and greater than l 0 , l A Rally F A The length of the side...

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Abstract

The invention discloses a grid strain analysis method for thin plate forming and an application of the method, and relates to forming production techniques of metal materials such as automobiles and small metal components. The method comprises the following steps: firstly, directly drawing grid lines with the same length in a centralized limited strain area for forming metal plate workpieces and on the surface of metal plates, after stamping deforming, measuring direct deformation values of the grid lines with wrinkles or cracks in the centralized limited strain area, and respectively adjusting the process according to the calculated deformation situations. The method can be applied to stamping sites at any time, and is generally not limited by conditions. The method can be widely popularized and used in production lines, and is low in cost and easy to master.

Description

technical field [0001] The invention relates to the forming production technology of metal materials such as automobiles and small hardware, especially the processing technology field of complex shapes made of thin plates to solve the problems of wrinkling, cracking and springback of formed parts on the stamping production site. Background technique [0002] In stamping production, when the strain value is greater than the elongation of the sheet, the sheet will crack; when the strain value is negative to a certain value or the strain value of adjacent parts changes greatly in the unconstrained state, the sheet will wrinkle and spring back . [0003] In order to obtain the material strain of the corresponding parts before and after the workpiece is formed, the laboratory of the scientific research institute adopts a measurement method called "grid strain analysis method". The method is to make a coordinate circular grid on the part of the preformed sheet that may wrinkle or...

Claims

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Application Information

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IPC IPC(8): B21C51/00B21D22/02
Inventor 王章喜杨玉才柳学平郭勇
Owner YIZHENG SHENWEI STAMPING
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