Flexible printed circuit board and flexible printed circuit board reflow soldering method

A flexible circuit board, flexible circuit board technology, applied in the structural connection of printed circuits, printed circuit components, printed circuit assembly of electrical components, etc., can solve the problems of unstable printing quality, low efficiency, low production efficiency, etc. Achieve the effect of saving typesetting time, reducing wear and tear, and improving production efficiency

Inactive Publication Date: 2014-12-24
SHIYI ELECTRONICS SCI & TECH HUIZHOU CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the traditional SMT process of FPC boards, it is generally completed through layout, printing, placement, reflow soldering, board closing, and glue (or mounting accessories) in sequence. However, in the typesetting process, typesetting has always been a single product , it is necessary to attach the FPC board one PCS (abbreviation of pieces, one piece, one piece or one piece, here refers to a single finished board) on the corresponding fixing groove of the printing fixture, because it is generally used on the same printing fixture Usually a plurality of fixed slots are set up, so that the efficiency is very low to take and place one by one multiple times, requiring a lot of manual input; secondly, after the printing jig is typesetting according to the above-mentioned single product, it is affected by the proficiency of the operator during printing , such as novice board layout, the printing is easy to shift, and the printing quality is unstable; moreover, the above-mentioned single product layout method in the board receiving process, the product needs to be collected individually, and the product positioning PIN is set at the product position, which is easy for the product Causes bad damage; moreover, the typesetting method of the single product is still a single pick-up and attachment during the glue-applying process, and the production efficiency is low

Method used

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  • Flexible printed circuit board and flexible printed circuit board reflow soldering method
  • Flexible printed circuit board and flexible printed circuit board reflow soldering method

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Embodiment

[0023] Such as figure 1 As shown, the present embodiment provides a flexible circuit board, including a number of FPC units 1 arranged thereon, the FPC units are independent single-piece finished boards, and the number of FPC units 1 maintains a jigsaw structure connected to each other, And the outer side of the jigsaw structure is connected with an outer frame or board edge 2 for matching and positioning with the printing jig. Positioning holes 3 are provided on the outer frame or board edge 2 .

[0024] Such as figure 2 As shown, the present invention also provides a method for reflow soldering of the above-mentioned flexible circuit board, comprising the following steps:

[0025] S01, attach and place several FPC units of the above-mentioned flexible circuit board on the corresponding fixing groove of the printing fixture, and match and position the printing fixture through the outer frame or board edge of the flexible circuit board;

[0026] S02, printing, using SMT pr...

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Abstract

The invention discloses a flexible printed circuit board which comprises a plurality of FPC units arrayed on the flexible printed circuit board. The FPC units are independent single finished product boards, the FPC units are kept to be of a mutually-connected jointed board structure. The outer side of the jointed board structure is connected with an outer frame or a board edge which is used for being matched with a printing jig for positioning. The invention further discloses a reflow soldering method used for the flexible printed circuit board. The method comprises the following steps that the FPC units of the flexible printed circuit board are placed on corresponding fixing grooves of the printing jig in an attaching mode, and the outer frame or the board edge of the flexible printed circuit board are matched with the printing jig for positioning; printing is conducted; paster is attached; reflow soldering is conducted; the board is collected, auxiliary materials are attached; punching is conducted, punching equipment is used for punching the FPC units of the jointed board structure into single wafers. The flexible printed circuit board is designed to be in a whole face type setting mode, so that in the type setting process, abrasion to products is reduced, type setting time is saved, and the production efficiency is improved. Meanwhile, in the board collecting process, the entire flexible printed circuit board is completed once, and damage to the products is avoided.

Description

technical field [0001] The invention relates to a flexible circuit board and a reflow soldering method for the flexible circuit board. Background technique [0002] With the rapid development of electronic products, flexible printed circuit boards (Flexible Printed Circuit, FPC) used in digital products are becoming more and more widespread. Due to the high production cost of FPC, reasonable FPC design can effectively control the production cost and processing cost of FPC, which is conducive to the cost control of the entire product, is conducive to the competitive advantage of the product in the market, and improves product competitiveness. [0003] At present, with the increase of labor costs, the automation transformation of enterprises is accelerating. In the field of electronic product production, SMT projects are put on the agenda by enterprises. In the traditional SMT process of FPC boards, it is generally completed through layout, printing, placement, reflow solderi...

Claims

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Application Information

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Patent Type & AuthorityApplications(China)
IPC IPC(8): H05K1/02H05K1/14H05K3/34
Inventor高明赵宪秀
OwnerSHIYI ELECTRONICS SCI & TECH HUIZHOU CO LTD