A manipulator for laying diode solder sheet

Abstract

The invention discloses a manipulator for laying soldering terminals of diodes, which comprises a support and a hollow sealed magazine, wherein the magazine is arranged on the support and is transversely extended out, a certain number of soldering terminals are loaded in the magazine, moreover, the manipulator is also provided with a soldering terminal plate which can be transversely extended and retracted relative to the magazine, up to 2000 pits are formed in the soldering terminal plate, the soldering terminal plate is also provided with a pipeline which communicates with each pit and is connected with a vacuumizer, and a motor is also arranged on one transverse end of the magazine, and can drive the magazine to transversely revolve clockwise and counterclockwise. The manipulator utilizes the simple cooperation between the motor, the magazine and the soldering terminal plate to automatically lay the soldering terminals in the magazine into the soldering terminal plate, thus realizing the mechanization of soldering terminal laying, greatly increasing efficiency and saving manpower. The usage of the manipulator can greatly increase the entry rate of the soldering terminals into the soldering terminal plate to more than 99.7 percent and decrease the repetitive entry rate to less than 0.1 percent, manpower is replaced, working efficiency is greatly increased, and meanwhile, the defect rate is remarkably decreased.

Description

technical field [0001] The invention relates to a manipulator structure for automatic diode packaging, belonging to the technical field of automatic operating devices. Background technique [0002] The packaging structure of the diode usually includes two opposite pins, and two layers of solder sheets respectively connected to the two pins, and a chip is sandwiched between the two layers of solder sheets. [0003] When laying the solder sheet traditionally, a plurality of pins are arranged on the lead sheet, the pins face down, and the end to be laid with the solder sheet faces upward, and the lead sheet is the bottom plate. At the same time, set the solder sheet material board with the concave hole corresponding to the pin hole on the lead material board. The concave hole on the solder sheet material board corresponds to the shape of the solder sheet. to the lead sheet, so that the solder sheets fall into the pin holes of the lead sheet one by one, and the solder sheet lay...

AI Technical Summary

Problems solved by technology

After all, the ability of manual operation is limited, and the frequency of vibrating the solder sheet is low, so it is difficult to distribute the solder sheet evenly in a short time, so the penetration rate of the traditional manual operation of the solder sheet is not high;

[0005] 2) The frequency of manual shaking of the solder sheet is low, and the hole penetration rate is low. Objectively, long-term shaking is required in order to increase the hole penetration rate. In this way, the production efficiency is low

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