The invention discloses a manipulator for laying soldering terminals of diodes, which comprises a support and a hollow sealed magazine, wherein the magazine is arranged on the support and is transversely extended out, a certain number of soldering terminals are loaded in the magazine, moreover, the manipulator is also provided with a soldering terminal plate which can be transversely extended and retracted relative to the magazine, up to 2000 pits are formed in the soldering terminal plate, the soldering terminal plate is also provided with a pipeline which communicates with each pit and is connected with a vacuumizer, and a motor is also arranged on one transverse end of the magazine, and can drive the magazine to transversely revolve clockwise and counterclockwise. The manipulator utilizes the simple cooperation between the motor, the magazine and the soldering terminal plate to automatically lay the soldering terminals in the magazine into the soldering terminal plate, thus realizing the mechanization of soldering terminal laying, greatly increasing efficiency and saving manpower. The usage of the manipulator can greatly increase the entry rate of the soldering terminals into the soldering terminal plate to more than 99.7 percent and decrease the repetitive entry rate to less than 0.1 percent, manpower is replaced, working efficiency is greatly increased, and meanwhile, the defect rate is remarkably decreased.