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Manipulator for laying soldering terminals of diodes

A technology of solder sheet and manipulator, which is applied in the direction of tin feeding device, welding equipment, metal processing equipment, etc., can solve the problems of low frequency of vibrating solder sheet material, low rate of solder sheet penetration, low frequency of solder sheet material, etc. , to achieve the effect of shortening the time of laying solder sheet, improving efficiency and yield rate, and improving production efficiency

Active Publication Date: 2015-03-04
SUZHOU UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

After all, the ability of manual operation is limited, and the frequency of vibrating the solder sheet is low, so it is difficult to distribute the solder sheet evenly in a short time, so the penetration rate of the traditional manual operation of the solder sheet is not high;
[0005] 2) The frequency of manual shaking of the solder sheet is low, and the hole penetration rate is low. Objectively, long-term shaking is required in order to increase the hole penetration rate. In this way, the production efficiency is low

Method used

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  • Manipulator for laying soldering terminals of diodes
  • Manipulator for laying soldering terminals of diodes
  • Manipulator for laying soldering terminals of diodes

Examples

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Embodiment Construction

[0024] The present invention will be further described below in conjunction with the accompanying drawings. The following examples are only used to illustrate the technical solution of the present invention more clearly, but not to limit the protection scope of the present invention.

[0025] like Figure 1-5 As shown, a manipulator for laying diode solder sheets includes a support body extending along the height direction, and a hollow sealing material box 2 protruding laterally is provided on the support body. There are solder sheets stacked in the magazine 2, and there is also a solder sheet material plate 4 that can expand and contract laterally relative to the magazine 2 driven by a translation device. The solder sheet 4 is densely covered with 2000 recessed holes 42 , and a pipeline 44 connecting each recessed hole 42 and connecting the vacuum device is also provided. A motor 6 is also provided at one end of the material box 2 in the transverse direction, and the motor...

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Abstract

The invention discloses a manipulator for laying soldering terminals of diodes, which comprises a support and a hollow sealed magazine, wherein the magazine is arranged on the support and is transversely extended out, a certain number of soldering terminals are loaded in the magazine, moreover, the manipulator is also provided with a soldering terminal plate which can be transversely extended and retracted relative to the magazine, up to 2000 pits are formed in the soldering terminal plate, the soldering terminal plate is also provided with a pipeline which communicates with each pit and is connected with a vacuumizer, and a motor is also arranged on one transverse end of the magazine, and can drive the magazine to transversely revolve clockwise and counterclockwise. The manipulator utilizes the simple cooperation between the motor, the magazine and the soldering terminal plate to automatically lay the soldering terminals in the magazine into the soldering terminal plate, thus realizing the mechanization of soldering terminal laying, greatly increasing efficiency and saving manpower. The usage of the manipulator can greatly increase the entry rate of the soldering terminals into the soldering terminal plate to more than 99.7 percent and decrease the repetitive entry rate to less than 0.1 percent, manpower is replaced, working efficiency is greatly increased, and meanwhile, the defect rate is remarkably decreased.

Description

technical field [0001] The invention relates to a manipulator structure for automatic diode packaging, belonging to the technical field of automatic operating devices. Background technique [0002] The packaging structure of the diode usually includes two opposite pins, and two layers of solder sheets respectively connected to the two pins, and a chip is sandwiched between the two layers of solder sheets. [0003] When laying the solder sheet traditionally, a plurality of pins are arranged on the lead sheet, the pins face down, and the end to be laid with the solder sheet faces upward, and the lead sheet is the bottom plate. At the same time, set the solder sheet material board with the concave hole corresponding to the pin hole on the lead material board. The concave hole on the solder sheet material board corresponds to the shape of the solder sheet. to the lead sheet, so that the solder sheets fall into the pin holes of the lead sheet one by one, and the solder sheet lay...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K3/06
CPCB23K3/0623B23K2101/40
Inventor 李相鹏黄海波王阳俊高萍王蓬勃杨湛胡海燕孙立宁
Owner SUZHOU UNIV
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