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A Memory Expansion Module Architecture Oriented to Fusion Architecture

An expansion module and memory technology, applied in the computer field, can solve the problems of low data transmission bandwidth and poor expansion performance, and achieve the effect of increasing memory expansion space

Active Publication Date: 2018-05-01
LANGCHAO ELECTRONIC INFORMATION IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] At present, the common memory expansion architecture adopts single-processor-based expansion, and this kind of application is oriented to single-processor and single-memory control. This mode has poor expansion performance and data transmission bandwidth in actual system applications. low deficiency

Method used

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  • A Memory Expansion Module Architecture Oriented to Fusion Architecture
  • A Memory Expansion Module Architecture Oriented to Fusion Architecture
  • A Memory Expansion Module Architecture Oriented to Fusion Architecture

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Embodiment 1

[0017] A memory expansion module architecture oriented to a converged architecture described in this embodiment, as shown in the attached figure 1 As shown, the entire integrated memory expansion module contains 4 storage interconnection modules, and the 4 storage interconnection modules can be interconnected. Each storage interconnection module provides a transmission bandwidth of 40GB / s to the outside, and is used to connect traditional processing units and system memory. And can realize the interconnection between the fusion memory expansion modules.

[0018] In the memory expansion module architecture oriented to the fusion architecture described in this embodiment, the internal structure of each storage interconnection module of the fusion memory expansion module is as follows: figure 2 As shown, the storage interconnection module is composed of a connection transmission module, a data exchange module, a storage control module and a storage connection module; wherein the...

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Abstract

The invention discloses a memory expansion module architecture oriented to a fusion architecture, and proposes a fusion memory expansion module with flexible expansion and high data bandwidth transmission functions. The module includes several storage interconnection modules, and each storage interconnection module is interconnected. The system memory and the traditional processing unit are connected through the integrated memory expansion module to realize data transmission and information interaction between the traditional processing unit and the system memory. Through the memory expansion module architecture, multiple parallel processors can physically share and allocate system memory resources through multiple planes, and at the same time, multi-level memory cascade expansion based on a single processor can be realized.

Description

technical field [0001] The invention relates to computer technology, in particular to a memory expansion module architecture oriented to fusion architecture. Background technique [0002] At present, the common memory expansion architecture adopts single-processor-based expansion, and this kind of application is oriented to single-processor and single-memory control. This mode has poor expansion performance and data transmission bandwidth in actual system applications. Low enough. [0003] With the development of high-speed data transmission and high-density integrated circuit technology, it is of great significance to study support for high data transmission bandwidth and multi-link memory expansion technology to solve the defects of the current memory expansion architecture based on single-processor expansion. imminent. Contents of the invention [0004] Aiming at the deficiencies of the prior art, a memory expansion module architecture oriented to a fusion architectur...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G06F3/06
CPCG06F3/0604
Inventor 王磊
Owner LANGCHAO ELECTRONIC INFORMATION IND CO LTD