Hole site precision analysis method for circuit board drilling

Abstract

The invention relates the technical field of numerical control drilling precision analysis, and discloses a hole site precision analysis method for circuit board drilling. The method comprises the following steps that first, drill-down is carried out by a drilling tool at a certain feeding speed; second, when the drilling tool is drilled into the drill entering surface of a circuit board, an error angle exists between the vertical center line of a spindle and the horizontal center line of the circuit board; third, the dynamic offset of the spindle of the drilling tool enables the drilling tool to be subjected to a component force in the horizontal direction; fourth, the action of the error angle and the dynamic offset of the spindle enables the drill point of the drilling tool to slip instantaneously; fifth, the drill-down is carried out by the drilling tool in an included angle instantaneously formed by the drill entering surface of the circuit board and the vertical direction; sixth, the negative deviation of the drill exiting surface of the circuit board is larger than the positive deviation of the drill entering surface of the circuit board, and a hole site deviation is formed. The hole site precision analysis method for the circuit board drilling uses a final accurate calculating formula of the hole site deviation value, the hole site deviation of the circuit board can be predicted at the early stage, and then the project optimization and the production operation can be guided.

Description

Technical field [0001] The invention relates to the technical field of numerical control drilling accuracy analysis, in particular to a circuit board drilling hole position accuracy analysis method. Background technique [0002] With the continuous development of electronic products in the direction of multi-function, small size, light weight, and high performance, the requirements for the miniaturization and high density of printed circuit boards are also increasing, and their products are also changing from traditional printed boards to high density. Multilayer printed board development. Drilling is the most critical process to achieve high-density requirements in the production of printed boards. Only when the process capability of high hole position accuracy in the circuit board drilling process is realized can it meet the development needs of high-density multilayer printed boards. [0003] At present, the industry's general requirements for the accuracy of drilling holes on ...

AI Technical Summary

Problems solved by technology

Among the existing methods for improving hole position accuracy, more optimization is based on the experimental results of single factors; for the generation mechanism of hole position deviation and the combination of multiple factors, no clear analysis has been given

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