Circuit board device assembly with dust removing and noise reducing functions
A technology of circuit boards and components, which is applied in the direction of printed circuits connected with non-printed electrical components, cooling/ventilation/heating transformation, etc. It can solve the problem of targeted heat dissipation of heat dissipation chips, difficulties in later maintenance, and difficulty in maintenance and installation by users. question
Inactive Publication Date: 2015-12-30
肖白玉
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Problems solved by technology
But this heat dissipation mode is easy to cause problems of installation and cost increase, and it also brings difficulties to later maintenance
[0003] At present, some cooling devices that can concentrate heat dissipation are often difficult to locate, install, open and maintain conveniently, causing troubles for users that are difficult to maintain and difficult to install.
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[0009] Combine below Figure 1-2 The present invention will be described in detail.
[0010] A dust-removing and noise-reducing circuit board device assembly according to an embodiment includes a circuit board device 12, a hinged frame 9 fixed at one end of the circuit board device 12, and a cooling plate device 2 connected to the hinged frame 9 , wherein, the main body block 91 of the hinged frame 9 is provided with a vertical guide rail groove 10 and a horizontal guide rail groove 7 for connecting with one end of the vertically slidable clamping positioning block 11 and the horizontally slidable clamping positioning block respectively. 5 is slidingly fitted, and the main body block 91 of the hinge frame 9 is also connected with one end of the vertical guide rod 3 wound with the vertical tension spring 4 and one end of the horizontal guide rod 14 wound with the horizontal tension spring 13 Fixedly connected, the other end of the vertical guide rod 3 and the other end of the ...
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The invention discloses a circuit board device assembly with dust removing and noise reducing functions. The circuit board device assembly comprises a circuit board device (12), a hinge frame (9) fixedly arranged at one end of the circuit board device (12), and a cooling board device (2) connected with the hinge frame (9), wherein a vertical guide rail groove (10) and a horizontal guide rail groove (7) are formed in a main body block (91) of the hinge frame (9), and used for being in sliding fit with one end of a vertically slidable clamp positioning block (11) and one end of a horizontally slidable clamp positioning block (5) respectively; the main body block (91) of the hinge frame (9) is fixedly connected with one end of a vertical guide rod (3) and one end of a horizontal guide rod (14) respectively; a vertical extension spring (4) and a horizontal extension spring (13) wind around the end of the vertical guide rod (3) and the end of the horizontal guide rod (14) respectively.
Description
technical field [0001] The invention relates to the field of circuit boards, in particular to a circuit board assembly capable of removing dust and reducing noise. Background technique [0002] In the field of circuit boards, it is often necessary to conduct targeted heat dissipation for heat dissipating components in the circuit board, such as high-power chips. Now it is often used to install a separate cooling fan on these chips to achieve effective heat dissipation. However, this heat dissipation mode is easy to cause problems of installation and cost increase, and also brings difficulties to later maintenance. [0003] At present, some cooling devices capable of centralized heat dissipation are often difficult to locate, install, open and maintain conveniently, causing troubles that are difficult to maintain and difficult to install for users. If the positioning is not accurate during the installation process, it will affect the targeted heat dissipation of the cooling...
Claims
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Inventor 肖白玉
Owner 肖白玉