Circuit board apparatus assembly with dust exhaust apparatus and adjustable air feed speed
A vacuum device and circuit board technology, which is applied in the direction of printed circuits, electrical components, printed circuits, etc. connected to non-printed electrical components, can solve the problem of increased installation costs, affecting the targeted heat dissipation of heat dissipation chips, and difficulty in maintenance and installation by users And other issues
Inactive Publication Date: 2016-03-09
肖白玉
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Problems solved by technology
But this heat dissipation mode is easy to cause problems of installation and cost increase, and it also brings difficulties to later maintenance
[0003] At present, some cooling devices that can concentrate heat dissipation are often difficult to locate, install, open and maintain conveniently, causing troubles for users that are difficult to maintain and difficult to install.
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[0009] Combine below Figure 1-2 The present invention will be described in detail.
[0010] According to an embodiment, a circuit board device assembly with a dust suction device and adjustable air supply speed includes a circuit board device 12, a hinged frame 9 fixed at one end of the circuit board device 12, and the hinged frame 9 The connected cooling plate device 2, wherein, the main body block 91 of the hinged frame 9 is provided with a vertical guide rail groove 10 and a horizontal guide rail groove 7 for respectively connecting with one end of the vertically slidable clamping positioning block 11 and the horizontal movable One end of the sliding clamping positioning block 5 is slidably matched, and the main body block 91 of the hinged frame 9 is also connected with one end of the vertical guide rod 3 wound with the vertical extension spring 4 and the end of the vertical extension spring 13 wound with it. One end of the horizontal guide rod 14 is fixedly connected, an...
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A circuit board apparatus assembly with a dust exhaust apparatus and an adjustable air feed speed comprises a circuit board apparatus (12), a hinged frame (9) fixedly arranged at one end of the circuit board apparatus (12), and a cooling plate apparatus (2) connected with the hinged frame (9); wherein a main body block (91) of the hinged frame (9) is provided with a vertical guide rail groove (10) and a horizontal guide rail groove (7) for being in sliding fit with one end of a clamping locating block (11) capable of sliding vertically and one end of a clamping locating block (5) capable of sliding horizontally respectively, and the main body block (91) of the hinged frame (9) is also fixedly connected with one end of a vertical guide rod (3) on which a vertical extension spring (4) is wound and one end of a horizontal guide rod (14) on which a horizontal extension spring (13) is wound.
Description
technical field [0001] The invention relates to the field of circuit boards, in particular to a circuit board assembly with a dust suction device and adjustable air supply speed. Background technique [0002] In the field of circuit boards, it is often necessary to conduct targeted heat dissipation for heat dissipating components in the circuit board, such as high-power chips. Now it is often used to install a separate cooling fan on these chips to achieve effective heat dissipation. However, this heat dissipation mode is easy to cause problems of installation and cost increase, and also brings difficulties to later maintenance. [0003] At present, some cooling devices capable of centralized heat dissipation are often difficult to locate, install, open and maintain conveniently, causing troubles that are difficult to maintain and difficult to install for users. If the positioning is not accurate during the installation process, it will affect the targeted heat dissipation...
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IPC IPC(8): H05K7/20H05K1/18B08B5/04
CPCH05K7/20145B08B5/04H05K1/182
Inventor 肖白玉
Owner 肖白玉