Uniform heat dissipation temperature control device

A technology of temperature control device and uniform heat dissipation, which is applied in the direction of cooling/ventilation/heating transformation, electrical components, electrical equipment structural parts, etc., and can solve the problems of bottom cooling and top heating, speed, air volume difficult to control, top cooling and bottom heating, etc. , to achieve uniform and efficient heat dissipation

Inactive Publication Date: 2016-09-07
SHENZHEN ENVICOOL TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] 1) It is difficult to control the speed and air volume passing through the air gaps;
[0006] 2) Even if the speed and air volume of each air-passing gap are equal, because the distance that the cold air passes before entering the wind-passing gap is quite different, especially for cabinets with high cabinets and large distances from the return air outlet, there will still be upper cooling. Under heat or under cold and over heat

Method used

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  • Uniform heat dissipation temperature control device
  • Uniform heat dissipation temperature control device
  • Uniform heat dissipation temperature control device

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Embodiment Construction

[0033] All features disclosed in this specification, or steps in all methods or processes disclosed, may be combined in any manner, except for mutually exclusive features and / or steps.

[0034] Any feature disclosed in this specification (including any appended claims, abstract), unless otherwise stated, may be replaced by alternative features which are equivalent or serve a similar purpose. That is, unless expressly stated otherwise, each feature is one example only of a series of equivalent or similar features.

[0035] Such as figure 1 , image 3 As shown, a uniform heat dissipation temperature control device 1 includes an indoor circulation part 2 of the cooling system, an outdoor circulation part 3 of the cooling system, an indoor and outdoor partition 4 and a housing 5 for accommodating these parts, the indoor circulation part 2 of the cooling system and the cooling system The outdoor circulation part 3 is separated by the indoor and outdoor partitions 4; the indoor ci...

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Abstract

The invention discloses a uniform heat dissipation temperature control device, belonging to the field of air conditioning systems. The uniform heat dissipation temperature control device comprises a cooling system indoor circulation part, a cooling system outdoor circulation part, an indoor and outdoor clapboard and a shell accommodating these parts, wherein the cooling system indoor circulation part and the cooling system outdoor circulation part are separated through the indoor and outdoor clapboard; the cooling system indoor circulation part comprises a heat exchanger and an inner fan module; the heat exchanger is vertically provided with a plurality of flow paths along a length direction of the shell, and the inner fan module is set along a vertical direction of the heat exchanger. The uniform heat dissipation temperature control device changes the conventional air supply mode, and finally guarantees uniform and high-efficiency heat dissipation through optimal design of air supply temperature, air supply volume and air supply speed.

Description

technical field [0001] The invention relates to the field of air conditioning systems, in particular to a uniform heat dissipation temperature control device suitable for heating equipment such as tall cabinets. Background technique [0002] With the development of the information age, knowledge and information have entered all walks of life with explosive growth, which leads to an increasing heat flux density, and the heat dissipation problem faced by the cabinet is becoming more and more serious. The current heat dissipation equipment generally uses air cooling to dissipate heat. However, the space of the heat dissipation equipment is small and the cooling capacity is limited. The current airflow organization form of sending up and down or down and up is very prone to local overheating. . [0003] Chinese patent application 201310651716.3 discloses a high-efficiency cooling and air-conditioning system for rack-mounted server cabinets, including a cooling module and a cabi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20
CPCH05K7/20745
Inventor 程彬曾庆镇陈建民
Owner SHENZHEN ENVICOOL TECH
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