LED (Light Emitting Diode) packaging structure with adjustable color temperature

A technology of LED packaging and color temperature, which is applied in the direction of electrical components, electrical solid devices, circuits, etc., can solve the problems of complex manufacturing process of packaged LED chip units, blue light leakage, and light quality defects, and achieve the elimination of light spot effect, The effect of avoiding light leakage

Inactive Publication Date: 2017-01-25
ZHONGSHAN LITI LIGHTING TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] The method of manufacturing white LED chips is: directly cover a layer of fluorescent film on the blue LED wafers with electrode pads prepared in advance, and form individual white LED chips after cutting. The problem is: white LED chips There will be blue light leakage on the bottom side of the bottom, causing light quality defects
The LED light source with this packaging structure achieves light color consistency, uniform light, and adjustable color temperature, but the manufacturing process of the wrapped LED chip unit is complicated, and the light emitted from the top and side of the chip is white light, making the wrapped LED chip After the white light emitted by the unit passes through the phosphor in the middle of the second fluorescent layer again, it will emit a yellowish or greenish mixed color light), which reduces the light quality and causes discomfort to the user

Method used

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  • LED (Light Emitting Diode) packaging structure with adjustable color temperature
  • LED (Light Emitting Diode) packaging structure with adjustable color temperature
  • LED (Light Emitting Diode) packaging structure with adjustable color temperature

Examples

Experimental program
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Effect test

Embodiment 1

[0023] Such as figure 2 As shown, Embodiment 1 is an adjustable color temperature COB adopting the LED packaging structure of the present invention, including a COB substrate 5, a first LED chip 21 and a second LED chip 22 arranged on the COB substrate 5, the first The upper end surface of the LED chip 21 is covered with a first fluorescent layer 3 (not shown in the figure), and the second fluorescent layer 4 is covered on the COB substrate 5 and the second LED chip 22, wherein the first fluorescent layer 3 and the second fluorescent layer 4 The thicknesses of the two fluorescent layers 4 on the COB substrate 5 are equal, and the first fluorescent layer 3 and the second fluorescent layer 4 are made of different fluorescent materials and have different color temperatures. When the first LED chip 21 and the second LED chip 22 are turned on, the light emitted upward by the first LED chip 21 passes through the first fluorescent layer 3 and becomes white light, and the light on th...

Embodiment 2

[0026] Such as image 3 As shown, Embodiment 2 is an adjustable color temperature SMD adopting the LED packaging structure of the present invention, including an LED bracket 6, and a first LED chip 21 and a second LED chip 22 arranged on the LED bracket 6, the first The LED chip 21 is covered with a first fluorescent layer 3, and a second fluorescent layer 4 for covering the second LED chip 22 and filling the groove of the LED bracket 6 is also provided, wherein the first fluorescent layer 3 and the second fluorescent layer 4 The thicknesses are different, and the heights of the first phosphor layer 3 and the second phosphor layer 4 on the LED bracket 6 are equal.

[0027] In this embodiment, the first LED chip 21 and the second LED chip 22 are respectively connected to different driving circuits on the LED bracket 6, and different driving signals are input to the first LED chip 21 and the second LED chip 22 to obtain an adjustable light color. SMD.

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Abstract

The invention discloses an LED packaging structure with adjustable color temperature, which includes a packaging substrate and an LED chip arranged on the packaging substrate, the LED chip includes a first LED chip and a second LED chip, and the LED chip of the first LED chip The upper end surface is covered with a first fluorescent layer, and a second fluorescent layer covering the packaging substrate and the second LED chip is also provided, wherein the first fluorescent layer and the second fluorescent layer have different color temperatures. The light emitted by the first LED chip and the second LED chip emits white light after only passing through the fluorescent layer once, which solves the problems of light polarization and light quality degradation; Both the sides of the bottom of the first LED chip and the second LED chip are wrapped by the second fluorescent layer, which prevents the blue light leakage of the first LED chip and the second LED chip from causing a decrease in light quality, obtains uniform light, and eliminates the need for only one LED The light spot effect when chip.

Description

technical field [0001] The invention belongs to the field of LED packaging, in particular to an LED packaging structure with adjustable color temperature. Background technique [0002] The method of manufacturing white light LED chips is: directly cover a layer of fluorescent film on the blue LED wafers with electrode pads prepared in advance, and form individual white light LED chips after cutting. The problem is: white light LED chips There will be blue light leakage on the bottom side of the , causing light quality defects. When using LED chips to manufacture LED light sources, in order to realize the adjustable color temperature of the LED light source, the commonly used technical means are to arrange the packaged LED chip unit and a bare LED chip unit formed by the first fluorescent layer in advance on the packaging substrate. A second fluorescent layer is also provided to cover the above-mentioned wrapped LED chip unit and a bare LED chip unit. The LED light source w...

Claims

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Application Information

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IPC IPC(8): H01L33/50H01L25/075
CPCH01L33/504H01L25/0753
Inventor程胜鹏许瑞龙刘火奇
OwnerZHONGSHAN LITI LIGHTING TECH