Flexible substrate with double-sided I-shaped composite structure

A technology of composite structure and flexible substrate, which is applied in the direction of electric solid-state devices, semiconductor devices, semiconductor/solid-state device components, etc., can solve the problem that flexible substrates cannot meet the needs of flexible electronic devices, and achieve increased surface utilization and extended service life Effect

Pending Publication Date: 2017-08-18
SOUTHWEST JIAOTONG UNIV
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The technical problem to be solved by the present invention is that a flexible substrate with a single-sided "I" structure cannot meet the needs of flexible electronic devices with a double-sided structure, and a flexible substrate with a double-sided "I" composite structure is provided, and the flexibility is increased. Electronic device occupancy on the surface of the substrate

Method used

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  • Flexible substrate with double-sided I-shaped composite structure
  • Flexible substrate with double-sided I-shaped composite structure

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Embodiment Construction

[0021] A flexible matrix embodiment of a double-sided "I" type composite structure such as figure 1 and figure 2 As shown, it consists of a base 10, a plurality of grooves arranged vertically and horizontally, a plurality of connecting posts and islands. The flexible matrix of the composite structure is the basis of electronic devices with good ductility, and the substrate 10 acts as a load bearing for the entire structure, and bears loads such as uniaxial tension, biaxial tension, torsion, and bending. The island body is an integrated platform for electronic devices. The transverse dimension of the island body (such as 41 and 42 in the figure) is greater than or slightly greater than the transverse dimension of the connecting column (such as 31 and 32 in the figure). The connecting cylinder mainly plays a strain complete isolation effect, so that a large deformation applied to the substrate 1 will not cause a large deformation of the electronic device. The islands connect...

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Abstract

The invention discloses a flexible substrate with a double-sided I-shaped composite structure. The flexible substrate comprises a substrate, grooves, connecting column bodies and island bodies, wherein the connecting column bodies are arranged on an upper surface and a lower surface of the substrate at equal intervals in a matrix form; the connecting column bodies on the lower surface of the substrate and the connecting column bodies on the upper surface of the substrate are in mirror symmetry; adjacent connecting column bodies are isolated by the grooves; the island bodies are arranged on the connecting column bodies; the transverse sizes of the island bodies are greater than or slightly greater than the transverse sizes of the connecting column bodies; adjacent island bodies are isolated by the grooves; electronic devices adhere to the island bodies; and crosslinking conductors connecting the electronic devices are hidden in the grooves. Through adoption of the flexible substrate, a strain complete isolation effect is achieved under a large deformation behavior, so that the service lives of the electronic devices are prolonged greatly. Moreover, the electronic device can be stuck to both sides at the same time, so that the surface utilization ratio of the flexible substrate is increased, thereby realizing a double-sided flexible electronic device having specific demands.

Description

technical field [0001] The invention relates to the technical field of flexible and stretchable electronics, in particular to a flexible substrate with a double-sided "I" type composite structure. Background technique [0002] Flexible and Stretchable Electronics (Flexible and Stretchable Electronics) technology is an emerging electronic technology that integrates electronic components and cross-linked conductors connecting electronic components on flexible and stretchable substrates. Compared with traditional integrated electronic technology, its most prominent feature is the integration of core electronic devices on a flexible substrate. Flexible substrates include various soft materials, such as plastics with superelastic properties and the surface layer of living organisms. The flexible substrate replaces the traditional rigid substrate, so that the large-scale deformation applied to the entire electronic device is basically absorbed by the deformation of the flexible s...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/498
CPCH01L23/4985
Inventor 赵晋生师明星
Owner SOUTHWEST JIAOTONG UNIV
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