The invention relates to a method for establishing a viscoplastic constitutive model of a solder bump considering damage. Comprising the following steps: performing a
uniaxial tension and
compression test on a solder bump sample to obtain a
macroscopic stress-strain curve of the sample; a unit cube finite
element model is established, the unit cube finite
element model adopts the solder constitutive model constructed in the step (2), loads are set for the model for numerical
simulation, and a stress-strain curve calculated by the model is obtained; and fitting the stress-strain curve obtained by
simulation in the step (3) with the
macroscopic stress-strain curve obtained by the tension and
compression test in the step (1) through a test parameter method, and determining parameters of the solder constitutive model, so that the final solder bump viscoplastic constitutive model considering the damage is established. The method can accurately predict the deformation and other mechanical behaviors of the solder under the thermal-force loading condition, and can be widely applied to fatigue life prediction and reliability evaluation of the
electronic packaging structure.