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Electronic device packaging structure

A packaging structure and electronic device technology, applied in the direction of electric solid devices, electrical components, semiconductor devices, etc., can solve problems such as cracks, affecting the stability of electronic components, glass breakage, etc., and achieve the effect of overcoming low reliability

Inactive Publication Date: 2018-01-23
宁波市鄞州诺亿电子元件厂
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The existing packaging structure is likely to cause glass breakage or cracks, which affects the airtightness of the packaging, thereby affecting the stability of electronic components.

Method used

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  • Electronic device packaging structure
  • Electronic device packaging structure

Examples

Experimental program
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Embodiment 1

[0017] Such as figure 1 As shown, the packaging structure of the electronic components of this embodiment includes a substrate 7, a seal is provided on the substrate 7, a lead 8 is arranged in the seal, a glass 9 is arranged between the lead 8 and the sealing wall, and the lead 8 includes an upper head 81 whose upper part is exposed on the surface of the substrate and glass and penetrates the seal. The upper head 81 is a cylindrical structure, and a base 82 is connected below the upper head 81. The diameter of the upper head 81 is It is larger than the base part 82; the edge of the base part 82 and the upper head 81 is provided with a solder joint 10; in order to improve the strength and performance, the diameter of the upper head 71 described in this embodiment is greater than or equal to the sealing 0.6 times the aperture.

[0018] Such as Figure 4 As shown, the welding surface 53 is displaced or tilted during the vibration process, the silicon-alumina wire bond slips, an...

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Abstract

The invention relates to the technical field of electronics and discloses an electronic device packaging structure. The electronic device packaging structure is characterized in that the structure comprises a substrate; a seal is arranged in the substrate; a lead is arranged in the seal; glass is arranged between the lead and the seal wall; the lead comprises an upper head part with the upper partexposed out of the substrate and the glass surface and passing through the seal; a leading base part is connected below the upper head part; and the diameter of the upper head part is larger than that of the leading base part. By adopting the above scheme, the packaging structure of the glass packaging electronic device overcomes defects of glass crack and fracture, poor air tightness, instability and low reliability of the whole device.

Description

technical field [0001] The invention relates to a packaging structure of electronic components, in particular to a packaging structure of electronic components. Background technique [0002] When the chip is used, the chip must be isolated from the external environment to prevent impurities in the air from corroding the chip circuit and causing electrical performance degradation; on the other hand, the packaged chip is also easier to install and transport. Therefore, when a chip is used on a circuit board, it is generally necessary to package the chip. [0003] Packaging refers to connecting the circuit pins on the chip to external joints with wires so as to connect with other devices. The packaging form refers to the shell used to install the semiconductor integrated circuit chip. Protect the chip and enhance the electrothermal performance, etc., and connect the contacts on the chip to the pins of the package shell with wires, and these pins are connected to other devices ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/31H01L23/49
Inventor 邬世通
Owner 宁波市鄞州诺亿电子元件厂
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