Server cooling case

A server and chassis technology, applied in the direction of instruments, electrical digital data processing, digital data processing components, etc., can solve the problems that the server chassis cannot meet the use requirements, do not provide corresponding cooling solutions, and reduce server speed, etc., so as to facilitate popularization Application, compact structure, avoiding the effect of server use

Active Publication Date: 2018-02-23
阳泉新科联合电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Since the server provides services in the network, the quality of this service is very important to the network computing environment that undertakes various applications. The computer hardware that undertakes this service must be able to guarantee the service quality. However, the current existing server capacity and processing capacity At the same time, a good heat dissipation solution is not provid

Method used

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Example Embodiment

[0024] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative work shall fall within the protection scope of the present invention.

[0025] See figure 1 with figure 2 , An embodiment provided by the present invention: a server heat dissipation chassis, including a chassis body 1, which includes a first side wall 2, a second side wall 8, a third side wall 9 and a fourth side wall 12, And the fourth side wall 12 and the second side wall 8 are both provided with a liquid outlet 4, a vent window 5 and a liquid inlet 7, the vent window 5 is provided with a dust-proof vent ...

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Abstract

The invention discloses a server cooling case which comprises a case body. The case body comprises a first side wall, a second side wall, a third side wall and a fourth side wall, the fourth side walland the second side wall are each provided with a liquid outlet, a ventilation window and a liquid inlet, a dustproof ventilation film is arranged on each ventilation window, a suction ventilator isinstalled at the positions, close to ventilation windows, of one side of the fourth side wall and one side of the second side wall, a U-shaped pipe is fixedly arranged on one side of the suction ventilator, a compressor is connected to one end of the U-shaped pipe, the compressor is connected with the air inlets through cooling liquid pipes, a liquid outlet is connected to the other end of the U-shaped pipe, and installing plates are fixedly installed on the two sides of the third side wall. By arranging the suction ventilator, the U-shaped pipe, the compressor and a hair dryer, the case can be effectively cooled, and therefore the phenomenon that use of the server is affected due to the fact that electric devices inside the case are hot excessively is avoided; the case is reliable to useand good in cooling effect.

Description

technical field [0001] The invention relates to the technical field of server equipment, in particular to a heat dissipation chassis for a server. Background technique [0002] A server is a high-performance computer in a network environment. It listens to service requests submitted by other computers on the network and provides corresponding services. Since the server provides services in the network, the quality of this service is very important to the network computing environment that undertakes various applications. The computer hardware that undertakes this service must be able to guarantee the service quality. However, the current existing server capacity and processing capacity At the same time, a good heat dissipation solution is not provided accordingly. When the CPU speed of the electrical device is too high or the CPU load is heavy, the temperature will rise sharply. Therefore, the server chassis cannot meet the use requirements, the heat dissipation effect is n...

Claims

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Application Information

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IPC IPC(8): G06F1/18G06F1/20
CPCG06F1/181G06F1/20
Inventor 邓东海邓红卫韩献功郭彩青郭锋涛邓红跃
Owner 阳泉新科联合电子科技有限公司
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