Photoelectric sensing module, preparation method thereof, and electronic device

A sensing module and photoelectric technology, applied in the field of photoelectric sensing, can solve the problems of high cost and unfavorable popularization of image recognition modules, and achieve the effects of saving materials, improving user experience, and reducing overall costs

Active Publication Date: 2018-04-24
柳州梓博科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, the cost of image recognition modules is still relative

Method used

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  • Photoelectric sensing module, preparation method thereof, and electronic device
  • Photoelectric sensing module, preparation method thereof, and electronic device
  • Photoelectric sensing module, preparation method thereof, and electronic device

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Embodiment Construction

[0056]Embodiments of the present invention are described in detail below, examples of which are shown in the drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary only for explaining the present invention and should not be construed as limiting the present invention.

[0057] In the description of the present invention, it should be understood that the terms "first" and "second" are used for description purposes only, and cannot be interpreted as indicating or implying relative importance or implicitly indicating the quantity of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of said features. In the description of the present invention, "plurality" means two or more, unless otherwise specifically defined.

[0058] In the descri...

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Abstract

The invention discloses a photoelectric sensing module, a preparation method thereof, and an electronic device. The preparation method for the photoelectric sensing module comprises the following steps that: providing a first substrate and a second substrate; forming a light emitting unit and an optical sensing unit between the first substrate and the second substrate, enabling the optical sensingunit to be positioned on the light emission side of the light emitting unit, and enabling the light induction surface of the optical sensing unit to be far away from the light emitting unit, whereinthe light emitting unit is a passive matrix organic electroluminescence diode; and packaging the first substrate and the second substrate. The electronic device comprises the photoelectric sensing module prepared by the preparation method.

Description

technical field [0001] The invention relates to the field of photoelectric sensing, in particular to a photoelectric sensing module, a preparation method thereof, and an electronic device with the photoelectric sensing module. Background technique [0002] At present, image recognition modules, such as fingerprint recognition modules, have gradually become standard components of electronic products such as mobile terminals. However, the cost of the image recognition module is still relatively high, which is not conducive to its widespread popularization. Contents of the invention [0003] The embodiments of the present invention aim to solve at least one of the technical problems in the prior art. Therefore, the embodiments of the present invention need to provide a photoelectric sensor module, a manufacturing method thereof, and an electronic device. [0004] A method for preparing a photoelectric sensor module according to an embodiment of the present invention include...

Claims

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Application Information

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IPC IPC(8): G06K9/00
CPCG06V40/1318
Inventor 李问杰
Owner 柳州梓博科技有限公司
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