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Flexible plate detection method

A detection method and sheet technology, which is applied in measuring devices, analytical materials, material thermal analysis, etc., can solve the problems of incomplete testing of flexible sheets, delamination, voids, etc.

Active Publication Date: 2018-06-19
GUANGZHOU FASTPRINT CIRCUIT TECH +2
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] Before the flexible sheet is applied to electronic products, it is necessary to test the flexible sheet, but the traditional test method is not comprehensive enough for the flexible sheet, and after it is applied to production, there will be quality risks such as delamination and voids caused by heat resistance problems

Method used

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Embodiment Construction

[0029] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the associated drawings. Preferred embodiments of the invention are shown in the accompanying drawings. However, the present invention can be embodied in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present invention more thorough and comprehensive.

[0030] It should be noted that when an element is referred to as being “fixed” to another element, it can be directly on the other element or there can also be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and similar expressions are used herein for purposes of ill...

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Abstract

The invention discloses a flexible plate detection method. The method comprises the steps as follows: treating a flexible plate to obtain a test plate, wherein the test plate comprises a copper foil layer and a substrate layer which are sequentially arranged, and the area of the copper foil layer is smaller than that of the substrate layer; placing the test plate in a heating and humidifying environment; heating the copper foil layer of the test plate. According to the flexible plate detection method, the flexible plate is processed into the test plate which is placed in the heating and humidifying environment, the substrate layer absorbs moisture, then, the copper foil layer of the test plate is heated, and quality detects such as layering, holes and the like can be produced at the jointof the substrate layer and the copper foil layer if the heat resistance of the flexible plate is poor. Compared with traditional test methods, the flexible plate detection method has the advantages that the heat resistance of the flexible plate under the moisture absorption condition can be detected, and whether the flexible plate can have the defects of layering, holes and the like under the moisture absorption condition due to poor heat resistance is judged.

Description

technical field [0001] The invention relates to the technical field of circuit board detection, in particular to a flexible board detection method. Background technique [0002] With the rapid development of electronic products in the direction of miniaturization, high density, high integration and multi-function, the requirements for flexible sheets are getting higher and higher, and the renewal speed of flexible materials is also getting faster and faster. [0003] Before the flexible sheet is applied to electronic products, it is necessary to test the flexible sheet, but the traditional test method is not comprehensive enough for the flexible sheet, and after it is applied to production, there will be quality risks such as delamination and voids caused by heat resistance problems . Contents of the invention [0004] Based on this, the present invention overcomes the defects of the prior art and provides a flexible plate testing method capable of testing the heat resist...

Claims

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Application Information

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IPC IPC(8): G01N25/00G01R31/28
CPCG01N25/00G01R31/2801
Inventor 李冲林楚涛李志东
Owner GUANGZHOU FASTPRINT CIRCUIT TECH
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