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Method for etching metal workpiece and method for manufacturing display panel

A metal workpiece and metal etching technology, which is applied in semiconductor/solid-state device manufacturing, electrical components, semiconductor devices, etc., and can solve problems such as short circuits, voids, and large slope angles.

Inactive Publication Date: 2021-01-19
BOE TECH GRP CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In the process of preparing metal wires, in order to ensure the charging rate and other technical requirements, the metal wire needs to reach a certain thickness, but the increase in thickness will cause the slope angle to become larger and cause various defects. For example, if the slope angle is too large, the top of the metal wire will The formation of a sharp part may cause a tip discharge to cause breakdown between the metal lines of different layers, resulting in a short circuit. In addition, if the slope angle is too large, it will cause the insulating layer covering the metal line to form a void at the bottom of the metal line, thereby causing defect

Method used

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  • Method for etching metal workpiece and method for manufacturing display panel
  • Method for etching metal workpiece and method for manufacturing display panel
  • Method for etching metal workpiece and method for manufacturing display panel

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Embodiment Construction

[0032] The technical solutions of the present invention will be further described below according to specific embodiments. The protection scope of the present invention is not limited to the following examples, which are listed for illustrative purposes only and do not limit the present invention in any way.

[0033] It should be understood that the drawings disclosed herein are not necessarily drawn according to the scale of actual devices and components. The shapes and thicknesses of the embodiments may be exaggerated in the drawings in order to clearly show the features of the embodiments of the present invention. In addition, the structures and devices in the drawings are shown schematically in order to clearly show the features of the embodiments of the present invention.

[0034] figure 1 It is a schematic diagram of the working state of etching a metal workpiece when no electric field is applied, such as figure 1 As shown, the metal wire 12 is laid on the substrate 1...

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Abstract

The invention provides a method of etching a metal workpiece to enable the metal workpiece to have the required profile and a manufacturing method of a display panel. The method of etching a metal workpiece includes the steps: applying a first electric field in the first direction along the etching solution, so as to change distribution in the first direction of metal ion concentration in the etching solution, so as to change the etching speed of the surface of the metal workpiece at different position in the first direction. The method of etching a metal workpiece utilizes the principle of corrosion potential in a copper etching mechanism, during the etching process, utilizes the electric field to guide the metal ions to form concentration gradient or concentration distribution in the etching solution so as to achieve the aim of changing the etching rate of the metal layer at different position and improving the metal line gradient angle, and can improve the etching homogeneity and the yield rate of products.

Description

technical field [0001] The invention relates to the field of etching, in particular to a method for etching a metal workpiece to make it have a desired shape and a manufacturing method for a display panel. Background technique [0002] In recent years, as the competition in the display industry has become increasingly fierce, the requirements for display quality have also become higher and higher. [0003] In the process of preparing metal wires, in order to ensure the charging rate and other technical requirements, the metal wire needs to reach a certain thickness, but the increase in thickness will cause the slope angle to become larger and cause various defects. For example, if the slope angle is too large, the top of the metal wire will The formation of a sharp part may cause a tip discharge to cause breakdown between metal lines of different layers, resulting in a short circuit. In addition, if the slope angle is too large, the insulating layer covering the metal line w...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/306H01L27/12
CPCH01L21/30608H01L27/124H01L27/127
Inventor 白金超韩笑丁向前王静宋勇志
Owner BOE TECH GRP CO LTD
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