Tin planting platform for chips
A platform and chip technology, applied in the field of chip maintenance equipment, can solve the problems of low tin planting efficiency, long tin planting time, inconvenient operation, etc., to ensure temperature accuracy and safety, short tin planting time, and high tin planting efficiency Effect
Inactive Publication Date: 2018-08-17
HUZHOU HUINENG ELECTROMECHANICAL TECH CO LTD
View PDF0 Cites 0 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
[0003] It is not difficult to see that the existing tin-planting equipment has complex structure, inconvenient operation, and problems such as shifting of the tin-planting net and inaccurate positioning, which may easily cause solder to stick to each other on the pad of the chip, making it unusable, and the time for tin-planting Long, low efficiency of tin planting
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0022] The embodiments involved in the present invention will be described in further detail below in conjunction with the accompanying drawings.
[0023] to combine Figure 1 to Figure 6, a chip tin planting platform, including a platform body, the platform body includes a console 1, a heating plate 2 is provided on the top of the console 1, a heater is provided in the heating plate 2, and an operating table 3 is provided on the top of the heating plate 2 , the center of the console 3 is provided with a groove 4, the center of the groove 4 is provided with a positioning groove 5, the side walls of the four grooves 4 are all provided with a first linear motor 6, and the base of the first linear motor 6 Fixedly installed on the side wall of the groove 4, the first telescopic rod 7 of the first linear motor 6 penetrates the side wall of the positioning groove 5 and extends into the positioning groove 5. The depth of the positioning groove 5 does not exceed the thickness of the c...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
Login to View More Abstract
The invention provides a tin planting platform for chips. The tin planting platform comprises a platform body and is characterized in that the platform body comprises a control panel, a heating plateis arranged at the top of the control panel, and a heater is arranged in the heating plate. The tin planting platform has the advantages that a chip which needs tin planting is positioned through a positioning groove, a corresponding tin planting net is fixed on an operation platform, a vacuum pump suck tin paste in a tin paste jar into a tin paste accommodating cavity in a squeezing plate for temporary storage, a second linear motor and a third linear motor press the squeezing plate against the tin planting net, a rotating motor drives the squeezing plate to rotate on the tin planting net, the tin paste is squeezed out through squeezing holes and smeared to the bonding pads of the chip which needs tin planting by the squeezing plate, the heating plate heats the tin paste according to settemperature, the chip which needs tin planting and the tin planting net do not move during the tin planting, precise positioning is achieved, mutual adhesion of the tin paste on the bonding pads is avoided, tin planting quality is guaranteed, and the tin planting platform is short in tin planting time and high in tin planting efficiency.
Description
technical field [0001] The invention relates to the technical field of chip maintenance equipment, in particular to a chip tin planting platform. Background technique [0002] In today's information age, with the rapid development of the electronic industry, computers, mobile phones and other products are becoming more and more popular. People have more and more functional requirements for electronic products, higher and higher performance requirements, and smaller and smaller volume requirements. , The weight requirements are getting lighter and lighter, which promotes the development of electronic products in the direction of multi-function, high performance, miniaturization and light weight. In order to achieve this goal, the feature size of the IC chip will be smaller and smaller, and the complexity will continue to increase, so the number of I / Os in the internal circuit of the chip will increase, and the I / O density of the package will continue to increase. In order to...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More Patent Type & AuthorityApplications(China)
IPC IPC(8): H01L21/60H01L21/67H01L21/68
CPCH01L24/75H01L21/67098H01L21/67248H01L21/68H01L2224/7515H01L2224/7525H01L2224/75804H01L2224/759
Inventoréįžé
OwnerHUZHOU HUINENG ELECTROMECHANICAL TECH CO LTD