A water-cooled computer main chassis with turbulence type two-way ventilation

A computer and main box technology, applied in the computer field, can solve the problem of low heat dissipation efficiency of the main box, and achieve the effect of accelerating heat dissipation efficiency and speeding up the flow speed

Active Publication Date: 2020-01-21
深圳华创电科技术有限公司
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  • Abstract
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  • Claims
  • Application Information

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Problems solved by technology

[0005] Aiming at the deficiencies of the prior art, the present invention provides a water-cooled computer main box with turbulent flow and two-way ventilation, which solves the problem of low heat dissipation efficiency of the main box

Method used

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  • A water-cooled computer main chassis with turbulence type two-way ventilation
  • A water-cooled computer main chassis with turbulence type two-way ventilation
  • A water-cooled computer main chassis with turbulence type two-way ventilation

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Embodiment Construction

[0029] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0030] see Figure 1-6, the present invention provides a technical solution: a spoiler-type two-way ventilated water-cooled computer mainframe box, including a box body 1, the top of the inner wall of the box body 1 is fixedly connected with a total drive mechanism 2, and the two sides of the box body 1 are respectively provided with Several air holes 3 and several air inlet holes 4, the air holes 3 are three groups, and the number of each group of air holes 3...

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Abstract

The invention relates to the technical field of computers, in particular to a disturbed flow type bidirectional ventilated water-cooled computer case. The technical problem to be solved by the invention is low heat dissipation efficiency of the conventional case. In order to solve the above technical problem, the invention provides a disturbed flow type bidirectional ventilated water-cooled computer case, comprising a case body, wherein a total driving mechanism is fixedly connected to the top of the inner wall of the case body, a plurality of air vents and a plurality of air inlets are respectively formed in two sides of the case body, a disturbed flow ventilation device is fixedly connected to the air vents on one side of the inner wall of the case body, and the output end of the total driving mechanism is movably connected with the input end of the disturbed flow ventilation device. In the technical solution, the disturbed flow device can extract the hot airflow inside the case during starting and disturb the airflow to cause the airflow to flow disorderly, so that the airflow can spread to all corners of the case, and the hot airflow inside the case can be discharged quickly.

Description

technical field [0001] The invention relates to the technical field of computers, in particular to a water-cooled main chassis of a computer with turbulent flow and two-way ventilation. Background technique [0002] A computer, commonly known as a computer, is a modern electronic computing machine used for high-speed computing. It can perform numerical calculations, logical calculations, and has storage and memory functions. It is a modern intelligent electronic device that can run according to the program and process massive data automatically and at high speed. The core part of the desktop computer is the main chassis. [0003] For example, CN 107885292 A proposes a computer mainframe chassis. The main problem to be solved is that when the computer runs large-scale software, the CPU and other components will generate heat during high-speed operation, which will cause the overheating of the chassis to have a certain impact on the operation of the system. Heat fins, draft r...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G06F1/20G06F1/18
CPCG06F1/181G06F1/20G06F2200/201
Inventor 崔永平
Owner 深圳华创电科技术有限公司
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