Assembly method for preparing intelligent power optimizer device capable of enhancing creepage distance

Abstract

The invention mainly relates to an assembling method for preparing an intelligent power optimizer device capable of increasing a creepage distance. The method comprises steps of providing a metal casing with a cavity body; covering a layer of first flexible insulating film over the inner wall of the cavity body; pressing an insulated tray on the first flexible insulating film; placing a metal sheet in a window opened in the tray; covering a layer of second flexible insulating film over the metal sheet; installing a circuit board on the tray while allowing a heat-generating electronic componentto be attached to the second flexible insulating film; and pressing one or more elastic members against the circuit board and then closing a back cover on the back side of the metal casing. After theabove assembly steps, reasonable electrical insulation is achieved between a printed circuit board and the metal casing, which can increase the creepage distance to a higher degree so as to ensure the safety and reliability of the entire power electronic device.

Description

technical field [0001] The present invention mainly relates to an assembly method of electric power devices. Specifically, an internal assembly method is adopted in which an enhanced creepage distance is provided on a printed circuit board suitable for a high-voltage environment. It is exported to the metal shell as a way to dissipate heat, and the creepage distance is increased to a high degree under the reasonable assembly method between the printed circuit board and the metal shell to ensure the safety and reliability of the entire power electronic device. Background technique [0002] Whether it is a large power electronic device or a portable miniature electronic device, with the rapid development of electronic technology, printed circuit boards are widely used in various fields, and almost all electronic devices cannot leave the corresponding printed circuit boards. In order to ensure the normal operation of electronic equipment, reduce mutual electromagnetic interfere...

AI Technical Summary

Problems solved by technology

A disadvantage of the traditional photovoltaic junction box is that the terminal assembly is fixed on the mounting plate first, and then installed in the base of the photovoltaic junction box through the mounting plate. The mounting plate occupies a certain convection space, which will affect the heat dissipation performance of the entire photovoltaic junction box

At present, some structures adopt the design of tightly wrapping the terminal assembly with two plastic parts and snapping it on the base. Although the mounting plate is omitted, the tight wrapping of the plastic parts also results in poor heat dissipation inside the box.

Another disadvantage of the traditional photovoltaic junction box is that there is no thermal isolation measure between the upper or lower cover of the photovoltaic junction box and the anti-reverse diode, so the heat generated by the diode is easy to burn the upper cover of the photovoltaic junction box

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