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FPC electromagnetic shielding film and manufacturing method thereof

An electromagnetic shielding film and thin film technology, applied in the fields of magnetic field/electric field shielding, electrical components, liquid chemical plating, etc., can solve the problems such as the inability to reduce the mutual interference of electronic components and the decline in the ability to resist electromagnetic interference, and achieve good insulation. , Reduce the possibility of breakdown, good shielding effect

Pending Publication Date: 2019-06-14
广东中晨电子科技有限公司
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Problems solved by technology

[0002] In recent years, with the widespread use of radio technology, electromagnetic pollution has become more and more common. At the same time, the use of low-voltage and low-power consumption of the circuit itself has significantly reduced the ability of the circuit itself to resist electromagnetic interference. Although the anti-electromagnetic interference film is plated on the product shell , can not only protect the product from the influence of external electromagnetic interference, but also reduce its own interference to the outside world. However, the anti-electromagnetic interference film coated on the outer shell of the product cannot reduce the mutual interference between the electronic components inside the product

Method used

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  • FPC electromagnetic shielding film and manufacturing method thereof
  • FPC electromagnetic shielding film and manufacturing method thereof

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Embodiment Construction

[0030] In order to facilitate the understanding of those skilled in the art, the present invention will be described in further detail below in conjunction with the accompanying drawings and embodiments:

[0031] like figure 1 , an FPC electromagnetic shielding film, comprising a first protective layer 1, an adhesive layer 2, a metal layer 3, a second protective layer 4 and a carrier film 5 arranged in sequence from top to bottom, and the adhesive layer 2 is used for bonding all The first protective layer 1 and the metal layer 3 and the adhesive layer 2 contain conductive nickel powder.

[0032] In the present invention, by adding conductive nickel powder into the adhesive layer 2, the adhesive layer 2 has conductivity. Compared with the conventional electromagnetic shielding film, the adhesive layer 2 of the present invention has conductivity, and no additional adhesive material is required to connect the conductive layer. By bonding with the metal layer 3, the electromagnet...

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Abstract

The invention relates to a FPC electromagnetic shielding film. The FPC electromagnetic shielding film comprises a first protective layer, an adhesive layer, a metal layer, a second protective layer and a carrier film which are sequentially arranged from top to bottom, wherein the adhesive layer is used for bonding the first protective layer 1 and the metal layer, and the adhesive layer contains conductive nickel powder. The electromagnetic shielding film is attached to the surface of an FPC, can prevent mutual influence among the FPCs in an electronic product, and has high breakdown resistanceand high shielding effect on electromagnetism.

Description

technical field [0001] The invention relates to the field of FPC, in particular to an FPC electromagnetic shielding film. Background technique [0002] In recent years, with the widespread use of radio technology, electromagnetic pollution has become more and more common. At the same time, the use of low voltage and low power consumption of the circuit itself has significantly reduced the anti-electromagnetic interference ability of the circuit itself. Although the anti-electromagnetic interference film is plated on the product shell , which can not only protect the product from the influence of external electromagnetic interference, but also reduce its own interference to the outside world. However, plating the anti-electromagnetic interference film on the shell of the product cannot reduce the mutual interference between the electronic components inside the product. SUMMARY OF THE INVENTION [0003] Based on this, an object of the present invention is to provide an FPC e...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K9/00C23C18/48C23C14/20
Inventor 罗晖邹向东
Owner 广东中晨电子科技有限公司
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