Collimator laminating method of under-screen fingerprint identification structure

A fingerprint identification and collimator technology, applied in the field of fingerprint identification, can solve the problems of serious bonding surface and poor alignment performance, and achieve good alignment, avoid deviation, easy alignment and precision control. Effect

Active Publication Date: 2019-08-23
SILEAD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] However, due to the poor alignment between the bonding material and the collimator during bonding, misalignment, size mismatch, etc. cannot be avoided. In addition, the phenomenon of air bubbles on the bonding surface is relatively serious after bonding

Method used

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  • Collimator laminating method of under-screen fingerprint identification structure
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  • Collimator laminating method of under-screen fingerprint identification structure

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Embodiment Construction

[0031] The details of the present invention can be understood more clearly with reference to the accompanying drawings and the description of specific embodiments of the present invention. However, the specific embodiments of the present invention described here are only for the purpose of explaining the present invention, and should not be construed as limiting the present invention in any way. Under the teaching of the present invention, the skilled person can conceive any possible modification based on the present invention, and these should be regarded as belonging to the scope of the present invention. It should be noted that when an element is referred to as being “disposed on” another element, it may be directly on the other element or there may also be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or intervening elements may also be present. The terms "mounted", "connec...

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Abstract

The invention discloses a collimator laminating method of an under-screen fingerprint identification structure, which relates to the technical field of fingerprint identification and comprises the following steps of: laminating a collimator with a preset size and a laminating layer with a size matched with that of the collimator to form a semi-finished product; cutting the semi-finished product into a single finished product with a target size, wherein the predetermined size is greater than the target size, and the single finished product is provided with a first surface provided with the laminating layer and a second surface deviating from the laminating layer; and laminating the first surface, provided with the attaching layer, of the single finished product to a sensor chip. According to the collimator attaching method of the under-screen fingerprint recognition structure, self-alignment of the collimator and the attaching layer can be achieved, and the situations of deviation, sizemismatching and the like are avoided; and meanwhile, the bonding is carried out in a large-size state, so that the bubble phenomenon of a bonding surface can be improved.

Description

technical field [0001] The invention relates to the technical field of fingerprint identification, in particular to a collimator bonding method for an under-screen fingerprint identification structure. Background technique [0002] Fingerprint identification technology is currently the most mature and cheap biometric identification technology, which is widely used in identification scenarios such as electronic equipment, access control systems, and attendance systems. [0003] An optical fingerprint chip is integrated in an electronic device, which is currently a way for the electronic device to realize the fingerprint identification function. In the existing packaging structure of the optical fingerprint chip, the alignment process between the optical fingerprint chip and the collimator is complicated, and the manufacturing cost is relatively high. [0004] Taking the under-screen fingerprint recognition structure as an example, when aligning the optical chip and the colli...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06K9/00B32B37/00B32B38/00
CPCB32B37/00B32B38/0004G06V40/1324
Inventor 吕亮刘文涛
Owner SILEAD
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