Insulating bonding sheet

A technology of bonding sheet and insulating layer, applied in electronic equipment, applications, household appliances, etc., can solve the problems of poor heat conduction effect and inability to achieve heat insulation effect, and achieve the effects of good insulation effect, stable work and simple processing procedures.

Inactive Publication Date: 2019-11-08
南亚电子材料(惠州)有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to provide an insulating adhesive sheet, which overcomes the defects of poor heat conduction effect and inability to achieve good heat insulation effect of the traditional existing adhesive sheet, realizes good insulation effect, simple processing procedure, and high precision of the adhesive sheet , The beneficial effect of stable circuit board work

Method used

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Embodiment Construction

[0023] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in combination with specific embodiments and with reference to the accompanying drawings. It should be understood that these descriptions are exemplary only, and are not intended to limit the scope of the present invention. Also, in the following description, descriptions of well-known structures and techniques are omitted to avoid unnecessarily obscuring the concept of the present invention.

[0024] Embodiments of the present invention are described in detail below, examples of which are shown in the drawings, wherein the same or similar reference numerals represent the same or similar elements or elements having the same or similar functions throughout.

[0025] In the description of the present invention, it should be noted that for orientation words, such as the term "center", "horizontal", "longitudinal", ...

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Abstract

The invention discloses an insulating bonding sheet, comprising an insulating layer, an antistatic layer, copper foil layers and a glass fiber paper impregnated resin bonding sheet, wherein the antistatic layer is arranged below the insulating layer; an anticorrosion layer is arranged below the antistatic layer; a first copper foil layer is arranged below the anticorrosion layer; the glass fiber paper impregnated resin bonding sheet is arranged below the first copper foil layer; and a second copper foil layer is arranged below the glass fiber paper impregnated resin bonding sheet. The insulating bonding sheet provided by the invention overcomes the defects of poor heat conduction effect and incapability of achieving good heat insulation effect in conventional bonding sheets, and achieves the beneficial effects of good insulation effect, simple processing procedures, high precision and stable circuit board operation.

Description

technical field [0001] The invention relates to the technical field of copper clad laminates, in particular to an insulating bonding sheet. Background technique [0002] As one of the basic materials of the electronics industry, copper clad laminates will inevitably increase with the increasing demand for printed circuit boards (PCBs) in different fields. Market participants will benefit from the development dividends. PCBs are the backbone of electronic components. The development of its PCB industry directly reflects the development level of a country's electronics industry to some extent, and the bonding sheet as the basic material of PCB plays an important role. Therefore, continuous improvement of adhesive sheets is an important prerequisite for continuous development. [0003] The existing bonding sheet has poor heat conduction effect, cannot achieve good heat insulation effect, poor insulation effect, cumbersome processing, and is inconvenient for stable operation of...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B15/20B32B15/14B32B17/02B32B17/06B32B17/12B32B7/12B32B27/04B32B33/00
CPCB32B5/02B32B5/26B32B7/12B32B15/14B32B15/20B32B17/061B32B17/067B32B33/00B32B2260/021B32B2260/046B32B2307/206B32B2307/21B32B2307/304B32B2307/714B32B2457/08
Inventor 王成长
Owner 南亚电子材料(惠州)有限公司
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