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Wafer storage conveyor

A transmission device and wafer storage technology, which is applied in the direction of conveyor objects, transportation and packaging, electrical components, etc., can solve the problem that the wafer storage transmission box cannot be opened normally, and achieve the effect of improving the reliability of use

Active Publication Date: 2022-03-29
YANGTZE MEMORY TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The main purpose of the present invention is to provide a wafer storage transfer device to solve the problem in the prior art that the wafer storage transfer box cannot be opened normally

Method used

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  • Wafer storage conveyor
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Embodiment Construction

[0022] It should be noted that, in the case of no conflict, the embodiments in the present application and the features in the embodiments can be combined with each other. The present invention will be described in detail below with reference to the accompanying drawings and examples.

[0023] It should be noted that, unless otherwise specified, all technical and scientific terms used in this application have the same meaning as commonly understood by those of ordinary skill in the art to which this application belongs.

[0024] In the present invention, in the absence of a contrary statement, the used orientation words such as "up and down" usually refer to the direction shown in the drawings, or refer to the vertical, vertical or gravity direction Similarly, for the convenience of understanding and description, "left and right" usually refer to the left and right shown in the drawings; The words are not used to limit the invention.

[0025] In order to solve the problem in...

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Abstract

The present invention provides a wafer storage and transfer device. The wafer storage and transfer device includes: a housing with an accommodating cavity and an opening communicating with the accommodating cavity, the accommodating cavity is used for accommodating wafers; a door assembly, including a first door, a second door and a locking structure, the first door The door body and the second door body are used to block the opening, the first door body is located outside the second door body, and the locking structure is arranged on the first door body; wherein, the locking structure has a first through hole communicating with the outside world, and the second door body is The door body has a second through hole, and the door body assembly has a pressure relief state in which the first through hole is communicated with the second through hole and a closed state in which the first through hole is disconnected from the second through hole. When the door body assembly is in the closed state When the locking structure is engaged with the housing, the door assembly can be switched between the pressure relief state and the closed state by operating the locking structure. The invention effectively solves the problem in the prior art that the wafer storage and transfer box cannot be opened normally.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a wafer storage and transfer device. Background technique [0002] Currently, wafer storage transfer boxes are used for loading and transporting wafers. After the wafer storage transfer box completes the high-temperature process, its internal temperature is high. When the wafer storage transfer box moves to the next process station, the temperature inside the wafer storage transfer box has dropped to room temperature, causing the wafer storage transfer box to The pressure inside the box is lower than the outside air pressure, so it cannot be opened normally. [0003] In the prior art, in order to solve the above-mentioned problems, a gas release valve is provided at the bottom of the wafer storage transfer box, and the pressure relief valve is pushed open by the top foot provided on the conveying device for transporting the wafer storage transfer box to achieve pressure r...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/677H01L21/673
CPCH01L21/67772H01L21/67778H01L21/67373H01L21/67393
Inventor 陈坪
Owner YANGTZE MEMORY TECH CO LTD
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