Computer mainframe box protection device based on temperature monitoring

Abstract

The invention provides a computer mainframe box protection device based on temperature monitoring. The computer mainframe box comprises a mainframe inner box body for placing a computer mainframe, a host outer box body which is used for protecting the host inner box body, a base plate which is used for placing a host, a dust removal and heat dissipation mechanism which is used for introducing windpower to cool and dissipate heat of the host in the host inner box body, and a temperature control mechanism which is used for controlling the wind power to perform centralized heat dissipation on anoverheated area in the host inner box body by overall planning the wind power. According to the computer mainframe box protection device based on temperature monitoring, the interference problem existing in heat dissipation and dust removal in the computer running process is researched; a heat dissipation and dust removal symbiotic structure is designed, and the problems that heat dissipation anddust prevention of an ordinary computer mainframe box interfere with each other, the heat dissipation effect tends to be gradually reduced along with prolonging of the service life, cleaning is inconvenient, the temperature difference in the box body is large, wind power needed by indiscriminate uniform heat dissipation is large, the output power is high, and efficiency is low are effectively solved.

Description

technical field [0001] The invention relates to the technical field of computers, in particular to a temperature monitoring-based protection device for a main computer chassis. Background technique [0002] Desktop computers have been gradually popularized in schools, offices and homes. Due to the need for heat dissipation, there are many through holes between the inside of the case and the outside. The internal dust will reduce the working efficiency of the host components in the box, resulting in damage to the components, and the various components in the box will generate a lot of heat when they work, which requires timely cooling of the chassis, but the chassis on the market only pass One heat dissipation fan is used for heat dissipation, the heat dissipation efficiency is not high, and the temperature in each area inside the main chassis is not uniform, the heat is concentrated in each dead corner, and the temperature measurement is not accurate, so the heat dissipation...

AI Technical Summary

Problems solved by technology

[0004] Aiming at the deficiencies of the prior art, the present invention provides a computer main case protection device based on temperature monitoring, which solves the mutual interference between the heat dissipation and dust prevention of the general computer main case, and the heat dissipation effect gradually decreases with the extension of the use time trend, and it is inconvenient to clean, the temperature difference in the box is large, the wind force required for uniform heat dissipation without difference, the output power is high, and the efficiency is low.

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