Soc chip structure for integrated system of infrared sensor signal acquisition

An infrared sensor and signal acquisition technology, applied in general control systems, control/regulation systems, instruments, etc., to facilitate secondary integration applications

Active Publication Date: 2021-02-19
NO 24 RES INST OF CETC
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

For the uncooled infrared imaging system, my country has developed a 320×240 thermistor focal plane array sensor, a long-wave infrared lens, and its image signal processing circuit components include ADC, digital signal processor (DSP), embedded PC and Liquid crystal display, etc., but so far, there is no multi-functional high-precision signal acquisition system chip product in China

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  • Soc chip structure for integrated system of infrared sensor signal acquisition
  • Soc chip structure for integrated system of infrared sensor signal acquisition

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Embodiment Construction

[0026]In order to enable those skilled in the art to better understand the technical solutions in the embodiments of the present invention, and to make the above-mentioned objectives, features, and advantages of the embodiments of the present invention more obvious and understandable, the technical solutions in the embodiments of the present invention are described below with reference to the accompanying drawings. Give further details.

[0027]In the description of the present invention, unless otherwise specified and limited, it should be noted that the term "connection" should be understood in a broad sense, for example, it can be a mechanical connection or an electrical connection, or it can be a communication between two components, which can be It is directly connected or indirectly connected through an intermediary. For those of ordinary skill in the art, the specific meanings of the above terms can be understood according to specific circumstances.

[0028]Such asfigure 1 As shown...

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Abstract

The invention discloses a SoC chip structure for an infrared sensor signal acquisition integrated system, including a CPU subsystem, a memory subsystem, an algorithm subsystem, an input sampling subsystem, a data output subsystem, a control output subsystem, a general external Set subsystem, clock reset subsystem, AHB bus, bridge and APB bus. The sub-system integrated on the chip of the invention can collect, analyze, process and output the image signal in the infrared sensor signal system, and has the function of temperature monitoring, realizes the single-chip integration of the infrared sensor signal acquisition integrated system, and solves the problem of the infrared sensor signal. The problems of high system development complexity, large volume and high power consumption of the discrete device integration implementation scheme in the signal acquisition integrated system are also convenient for users to perform secondary integration applications, and can also meet similar application requirements in the field of infrared image processing.

Description

Technical field[0001]The invention relates to the field of infrared image processing, in particular to an SoC chip structure used for an integrated system of infrared sensor signal acquisition.Background technique[0002]The integrated infrared sensor signal acquisition system includes infrared sensor signal conditioning, acquisition, adaptive gain and bias control, image preprocessing and transmission, sensor bias power management, detector timing generation, temperature monitoring and other functional integration, and it also embeds Programming the microprocessor. It is necessary to realize an integrated system of infrared sensor signal collection, which requires ADC to collect image signals, through gain feedback technology, and then processed by adaptive image algorithms, and finally output through parallel-to-serial conversion. According to the control requirements of the infrared sensor signal acquisition integrated system, the infrared sensor signal acquisition integrated syste...

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G05B19/042
CPCG05B19/0423G05B2219/25257
Inventor 张涛黄晓宗黄文刚李健壮廖鹏飞朱正吉星宇
Owner NO 24 RES INST OF CETC
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