Bending gasket assembly, flexible oled module and oled device

Abstract

The invention relates to the field of OLED technology, and discloses a bent gasket assembly, a flexible OLED module and an OLED device. The bent gasket assembly includes: a flat liquid-cooled tube, a flat liquid-cooled tube and a screen bending support area of ​​a product Corresponding settings: two arc-shaped liquid-cooled tubes are connected to the flat liquid-cooled tube and are respectively located on both sides of the flat liquid-cooled tube and bonded to the side of the product cover. The extension direction of the flat liquid-cooled tube is the same as the flat liquid-cooled tube. The extension direction of the tube is vertical. The bent gasket assembly provided by the present invention can enhance the heat dissipation of the bent gasket assembly because the coolant circulates in the flat liquid cooling tube and the two arc liquid cooling tubes, thereby greatly reducing the accumulation of a large number of drive chips in the product. The occurrence of damage caused by heat effectively protects the driver chip of the product, thereby improving the performance of the product.

Description

technical field [0001] The present invention relates to the technical field of OLEDs, and in particular, to a bending gasket assembly, a flexible OLED module and an OLED device. Background technique [0002] With the advancement of science and technology, OLED display screens are used more and more in life, and flexible OLED screens that can be bent are gradually popularized. [0003] In the flexible OLED modules in the prior art, the gaskets located under the driver chip are mostly foam and polyester materials. The arrangement of such gaskets is likely to cause damage to the driver chip due to poor heat dissipation, causing the driver chip to accumulate a large amount of heat, thereby affecting the performance of the driver chip. product performance. SUMMARY OF THE INVENTION [0004] The present invention provides a bending gasket assembly, a flexible OLED module and an OLED device. The bending gasket assembly can enhance the heat dissipation of the bending gasket assemb...

AI Technical Summary

Problems solved by technology

[0003] In the flexible OLED module in the prior art, the spacer located under the driver chip is mostly made of foam and polyester. The setting of this kind of spacer is easy to cause damage to the driver chip due to poor heat dissipation, which will cause a large amount of heat to accumulate, thereby affecting product performance

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