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A light-emitting diode non-guide pillar sealing molding process

A light-emitting diode and molding process technology, which is applied to semiconductor devices, electrical components, circuits, etc., can solve problems such as poor fixing effect, low fixing efficiency of fixing structure, and inability to adjust and adapt light-emitting diode tubes, so as to improve the fixing effect and improve The effect of production efficiency and production quality

Active Publication Date: 2021-09-03
肇庆市华大电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, the fixation structure of this solution still has the problems of low fixation efficiency, poor fixation effect, and the inability to adjust and adapt to each eccentric light-emitting diode tube. This process quickly and effectively fixes the light-emitting diodes through the set fixing device, and at the same time can adjust and adapt to each eccentric light-emitting diode tube, thus greatly improving the production efficiency and production quality of light-emitting diodes

Method used

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  • A light-emitting diode non-guide pillar sealing molding process
  • A light-emitting diode non-guide pillar sealing molding process
  • A light-emitting diode non-guide pillar sealing molding process

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Experimental program
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Effect test

Embodiment approach

[0034] As an embodiment of the present invention, a guide frame 32 is provided between the guide table 3 and the support plate 12, a chute 33 is provided on the bottom surface of the guide frame 32, and a bottom end of the guide table 3 is provided with The slide block 34 that can slide freely inside the chute 33, the No. 2 spring 35 is connected between the side wall of the guide table 3 and the guide frame 32; The clamping plate 54 on the metal bracket 5 that produces errors in size is easily misplaced with the matching clamping block 4, thereby affecting the matching effect between the clamping plate 54 and the clamping block 4. At this time, by setting the guide table 3 so that it can be placed on the guide frame 32 In the form of activity, when the metal bracket 5 is eccentric, the lead-in end 53 exerts force on the guide table 3 at this time, so that the guide table 3 stretches the second spring 35 and drives the slider 34 to slide inside the chute 33 , so that the slidi...

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Abstract

The invention belongs to the technical field of sealing and molding of electronic components, and specifically relates to a molding process for LED sealing without guide posts; A sealing groove is provided on the end surface of the plate, and a support cavity is arranged inside the sealing groove, and a sealing capsule is arranged inside the support cavity, and a guide platform is installed on the end of the support plate, and a guide platform is installed on the side of the guide platform. A limit slot is provided, a block is installed on the top surface of the support plate, a diode tube is provided on the top of the fixing device, and the diode tube is connected by a connection plate, and the end of the connection plate is provided with a lead-in end, so The middle part of the connecting plate is provided with a clamping plate; the present invention can quickly and effectively fix the light-emitting diodes through the set fixing device, and at the same time can carry out corresponding adjustment and adaptation for each eccentric diode tube, which greatly improves the production of light-emitting diodes. efficiency and production quality.

Description

technical field [0001] The invention belongs to the technical field of plastic sealing and molding of electronic components, and in particular relates to a technology of plastic sealing and molding of light-emitting diodes without guide posts. Background technique [0002] In order to improve the production efficiency of LED sealing and molding, people usually first punch and cut a piece of metal sheet suitable for use as the tube pole of the LED into a metal bracket containing multiple pairs of tube poles connected as a whole, and then use the bracket to connect each pair of tube poles. The poles are inserted into a group of sealing capsules at the same time, filled with glue, baked, and sealed and formed to form multiple light-emitting diodes at a time. After the sealing and molding are completed, each diode is taken out of each capsule through the bracket at the same time, and then the bracket is cut off. A plurality of finished products of light emitting diodes separated...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/48H01L33/52
CPCH01L33/483H01L33/52H01L2933/0033H01L2933/005
Inventor 吕思琪
Owner 肇庆市华大电子科技有限公司
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