Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Package body and packaging process with electromagnetic shielding function

A technology of electromagnetic shielding and packaging technology, applied in the direction of electric solid devices, circuits, electrical components, etc., can solve the problems of inability to achieve electromagnetic shielding function, difficult to meet the needs of high-frequency signal products in the field of communication, etc., achieve good electromagnetic shielding function, realize Electromagnetic shielding function, the effect of improving quality

Active Publication Date: 2022-02-08
FOREHOPE ELECTRONICS NINGBO CO LTD
View PDF8 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In the existing double-sided chip packaging structure and method, the electromagnetic shielding function cannot be realized, so it is difficult to meet the product requirements of high-frequency signals in the communication field

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Package body and packaging process with electromagnetic shielding function
  • Package body and packaging process with electromagnetic shielding function
  • Package body and packaging process with electromagnetic shielding function

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0044] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments It is a part of embodiments of the present invention, but not all embodiments. The components of the embodiments of the invention generally described and illustrated in the figures herein may be arranged and designed in a variety of different configurations.

[0045] Accordingly, the following detailed description of the embodiments of the invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely represents selected embodiments of the invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art wi...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a packaging body with electromagnetic shielding function and a packaging process, which relate to the field of electronic products. The package body includes a package substrate, a first chip, a second chip, a first plastic package, a second plastic package and a shielding layer. The packaging substrate includes a first mounting surface and a second mounting surface oppositely arranged, the first chip is arranged on the first mounting surface, and the second chip is arranged on the second mounting surface; the first plastic package is arranged on the first mounting surface to plastic seal the first For the chip, the second plastic package is arranged on the second mounting surface to package the second chip. The first mounting surface is provided with at least one grounding pad, and the second mounting surface is provided with a ball-planting pad; the shielding layer is covered on the first plastic package and the packaging substrate, and the grounding pad is connected to the shielding layer, which can achieve good electromagnetic shielding functions to meet the product requirements of high-frequency signals in the communication field.

Description

technical field [0001] The invention relates to the field of electronic products, in particular to a packaging body with an electromagnetic shielding function and a packaging process. Background technique [0002] In the field of electronic devices, there are many integrated circuit chips (Integrated Circuit, IC for short) that are sensitive to electromagnetic interference, such as radio frequency chips, especially high frequency radio frequency chips. These chips must be electromagnetically shielded before work, otherwise It is difficult to work normally due to electromagnetic interference. [0003] With the rapid development of the semiconductor industry, the miniaturization of electronic products is getting higher and higher density, more and more functions, and the product size is getting smaller and smaller. Therefore, the double-sided chip packaging structure is widely used in the semiconductor industry. It encapsulates chips with different functions on both sides (fr...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H01L25/18H01L21/56H01L23/31H01L23/552H01L25/065
CPCH01L25/0657H01L25/18H01L23/3107H01L23/552H01L21/56H01L2224/48091H01L2924/00014
Inventor 何正鸿李立兵
Owner FOREHOPE ELECTRONICS NINGBO CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com