30results about How to "Realize electromagnetic shielding function" patented technology

The invention provides a packaging body with electromagnetic shielding function and a packaging process, which relate to the field of electronic products. The package body includes a package substrate, a first chip, a second chip, a first plastic package, a second plastic package and a shielding layer. The packaging substrate includes a first mounting surface and a second mounting surface oppositely arranged, the first chip is arranged on the first mounting surface, and the second chip is arranged on the second mounting surface; the first plastic package is arranged on the first mounting surface to plastic seal the first For the chip, the second plastic package is arranged on the second mounting surface to package the second chip. The first mounting surface is provided with at least one grounding pad, and the second mounting surface is provided with a ball-planting pad; the shielding layer is covered on the first plastic package and the packaging substrate, and the grounding pad is connected to the shielding layer, which can achieve good electromagnetic shielding functions to meet the product requirements of high-frequency signals in the communication field.

A cabinet-type electric connector consists of a plug and a socket; the plug and a shell of the socket are provided with a plurality of cavities for mounting a plurality of corresponding functional modules; and the abutting end of each functional module is provided with a mobile electromagnetic shielding device and a guide positioning device, wherein the mobile electromagnetic shielding device consists of a shielding plate, an elastic shielding reed, an insulating sleeve and a spring. By using a matching form of the mobile shielding plate and the elastic shielding reed, the electromagnetic shielding function after the connector is plugged and separated is well implemented; meanwhile, the arranged guide positioning device can well implement guiding and positioning when the plug is plugged in the socket so as to realize automatic alignment of the connector; and the cabinet-type electric connector has higher mounting error compensation capability, meets the requirements of cabinet-type application occasions, and has stronger practicability.

The invention provides an integrated antenna shell for a Mars exploration landing rover and a preparation method of the integrated antenna shell. The integrated antenna shell is formed through the steps of shell molding mold manufacturing, carbon fiber / polyimide prepreg preparation, shell laying-up, imidization, curing, demolding, machining, metal plating on the inner surface of the shell and thelike. According to the integrated antenna shell for the Mars exploration landing rover, by the adoption of an auxiliary molding manner of a female and male combined mold and a high-temperature-resistant silicone rubber soft mold, one-time integrated molding of an autoclave molding process is adopted, and the prepared shell has the multi-function integrated characteristics of the light mass, resistance of the high temperature of 370 DEG C, space environment resistance and structure bearing; and meanwhile a coupling technology of a nanometer silver particle modified shell base body and an innersurface vacuum sputtering metallization layer is adopted, an electromagnetic shielding function of the antenna shell is achieved, the containing structure space occupied by a traditional antenna connecting cable is omitted, the interface connection is further reduced, and the structure manner of the shell is simplified while the space utilization rate is increased.

The application provides an electromagnetic shielding structure manufacturing process and an electromagnetic shielding structure, which relate to the technical field of semiconductor packaging. The manufacturing process of the electromagnetic shielding structure includes forming a first bonding pad, a second bonding pad and a plurality of third bonding pads on the substrate, wherein the plurality of third bonding pads are arranged at intervals and surround the first bonding pad and the second bonding pad ; between the third pads, the first connection wires with grounding properties are arranged in a staggered distribution; the chip is mounted on the substrate; wherein, the chips are respectively electrically connected to the first pad and the second pad, and are located at the first connection online; form a plastic package on the substrate, and plant balls on the side of the substrate away from the plastic package; cut the plastic package and the substrate along the dicing line to form a single product; wherein, the dicing line is located on the third pad close to the chip side, so that the first connection line is exposed from the side of the plastic package after cutting; a metal layer is formed on the surface of the plastic package of a single product, so that the metal layer is electrically connected to the first connection line, and a good electromagnetic shielding effect is achieved.