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30results about How to "Realize electromagnetic shielding function" patented technology

Light high-intensity electromagnetic windshield glass and manufacturing method thereof

The invention relates to a piece of electromagnetic shielding glass and a manufacturing method thereof, specifically, to a piece of light high-intensity electromagnetic windshield glass with an electric heating function and a manufacturing method thereof. A metal grid structure is prepared on a flexible substrate to realize the electromagnetic shielding function; combination with the traditional electric heating glass manufacturing process is carried out to prepare a piece of light high-intensity electromagnetic shield glass. On the one hand, the intensity reduction caused by preparing a low-resistance transparent conductive film on a piece of load-bearing glass is avoided; and on the other hand, the conflict between the high shielding performance and the high light transmittance requirement of the traditional electromagnetic shielding glass is eliminated. The prepared electromagnetic shielding glass has the high light transmittance larger than or equal to 75%, the reduced weight withthe surface density less than or equal to 10kg/m<2>, and the high intensity; the total thickness does not exceed 6.0 mm and the shielding performance is larger than o equal to 40 dB(0.3-18 GHz). And the glass is resistant to the impact by a bird with the weight of 1.0kg at the speed less than or equal to 330km/h without any penetration and piece spatter.
Owner:AVIC BEIJING INST OF AERONAUTICAL MATERIALS

Front shell component and metal front shell structure of electronic equipment

The invention relates to a front shell component and metal front shell structure of electronic equipment. The front shell component and the metal front shell structure can replace electromagnetic shields in the electronic equipment and conduce to reducing the thickness of the electronic equipment. The front shell component comprises the metal front shell structure and a metal sheet, wherein a plurality of through holes corresponding to devices to be shielded on a printed circuit board in the electronic equipment one to one are formed in the metal front shell structure; the metal sheet closes the ends, far away from the printed circuit board, of the plurality of through holes, so that the metal sheet and the plurality of through holes form a plurality of corresponding groove structures; the metal sheet is also electrically connected to the metal front shell structure; and the forming position and dimension of each through hole are matched with the corresponding device to be shielded, so that when the metal front shell structure and the printed circuit board are assembled in the electronic equipment in a mutual fitting manner, the groove structure corresponding to each through hole can contain the corresponding device to be shielded and keeps a preset interval from the contained device to be shielded.
Owner:XIAOMI INC

Anti-electromagnetic-interference insulating silicone rubber cloth and preparation method thereof

The invention discloses anti-electromagnetic-interference insulating silicone rubber cloth and a preparation method thereof. The anti-electromagnetic-interference insulating silicone rubber cloth comprises a silicone rubber layer and a graphene layer attached onto the surface of the silicone rubber layer, wherein chemical cross-linking and interface grafting of the graphene layer and the siliconerubber layer are realizd through a silane coupling agent KH560. The preparation method comprises the following steps: 1) preparing the silicone rubber layer by using a calendering method, wherein thesilicone rubber layer contains the silane coupling agent KH560; 2) preparing graphene layer slurry, wherein the slurry contains the silane coupling agent KH560; and 3) coating the surface of the silicone rubber layer with the graphene layer slurry to form the graphene layer. According to the invention, the graphene layer with electromagnetic shielding capability is compounded with the heat-conducting and insulating silicone rubber layer, so an insulator function is obtained in a vertical direction, a conductor function is obtained in a horizontal direction and at a graphene electromagnetic shielding layer side, and the functions of insulation, electromagnetic shielding and heat conduction are realized at the same time; moreover, the anti-electromagnetic-interference insulating silicone rubber cloth has excellent external insulation performance, and can meet the external insulation requirements of power equipment or the insulation requirements of a 10-KV electromagnetic field environment.
Owner:BEIJING GUODIAN FUTONG SCI & TECH DEV +3

Packaging body with electromagnetic shielding function and packaging process

The invention provides a packaging body with an electromagnetic shielding function and a packaging process, and relates to the field of electronic products. The packaging body comprises a packaging substrate, a first chip, a second chip, a first plastic packaging piece, a second plastic packaging piece and a shielding layer. The packaging substrate comprises a first mounting surface and a second mounting surface which are oppositely arranged; the first chip is arranged on the first mounting surface, and the second chip is arranged on the second mounting surface; the first plastic package pieceis arranged on the first mounting surface to package the first chip in a plastic mode; and the second plastic package piece is arranged on the second mounting surface to package the second chip in aplastic mode. The first mounting surface is provided with at least one grounding bonding pad, and the second mounting surface is provided with a ball mounting bonding pad; and the shielding layer covers the first plastic package piece and the package substrate; and the grounding bonding pad is connected with the shielding layer, so that a good electromagnetic shielding function can be realized, and the product requirements for high-frequency signals in the communication field are met.
Owner:FOREHOPE ELECTRONICS NINGBO CO LTD

Low-power type chip transformer with electromagnetic shielding function

The invention relates to a low-power type chip transformer with an electromagnetic shielding function. The transformer comprises a resin packaging layer, a first metal grid and a second metal grid. The outer side of the resin packaging layer is provided with a metal powder film. The side of the resin packaging layer is provided with a conductor. The first metal grid is arranged in the resin packaging layer. The first metal grid is arranged in the resin packaging layer, a first round hole is formed in the outer wall of the first metal grid, the second metal grid is arranged in the resin packaging layer, a second round hole is formed in the outer wall of the second metal grid, magnetic particles are arranged on the outer side of the resin packaging layer, and magnetic fibers are arranged onthe outer side of the resin packaging layer. The transformer has the beneficial effects that through respectively using four layers of different composite electromagnetic shielding packaging structures in the transformer packaging layer and the metal powder film, circuit elements are protected, the influence of electromagnetic waves on the external environment is reduced, and the composite electromagnetic shielding packaging structure is suitable for various application occasions with high requirements in different complex environments.
Owner:无锡燊旺和电子科技有限公司

Package body and packaging process with electromagnetic shielding function

The invention provides a packaging body with electromagnetic shielding function and a packaging process, which relate to the field of electronic products. The package body includes a package substrate, a first chip, a second chip, a first plastic package, a second plastic package and a shielding layer. The packaging substrate includes a first mounting surface and a second mounting surface oppositely arranged, the first chip is arranged on the first mounting surface, and the second chip is arranged on the second mounting surface; the first plastic package is arranged on the first mounting surface to plastic seal the first For the chip, the second plastic package is arranged on the second mounting surface to package the second chip. The first mounting surface is provided with at least one grounding pad, and the second mounting surface is provided with a ball-planting pad; the shielding layer is covered on the first plastic package and the packaging substrate, and the grounding pad is connected to the shielding layer, which can achieve good electromagnetic shielding functions to meet the product requirements of high-frequency signals in the communication field.
Owner:FOREHOPE ELECTRONICS NINGBO CO LTD

High-transmittance flexible manganin meter with electromagnetic shielding function

A high-transmittance flexible manganin meter with an electromagnetic shielding function comprises a substrate, a sensitive element and electrodes are arranged on the substrate, the input end and the output end of the sensitive element are connected with the two electrodes respectively, and packaging layers are arranged on the surfaces of the sensitive element and the electrodes; the sensitive element is made of manganese-copper foil, and the thickness is 5 microns; the electrodes and the sensitive element are of an integrated structure and are made of the same manganese-copper foil through a laser engraving or chemical corrosion process; the substrate and the packaging layers are sandwich structures, the middle layer is a PI/silver nanowire composite film with the thickness of 25 microns, the upper layer and the lower layer are ceramic films with the thickness of 1 micron, and the ceramic films are formed on the surface of the middle layer through an MEMS sputtering process; the substrate, the packaging layers, the electrodes and the sensitive element form the manganin meter through a hot-pressing packaging process. The manganin meter can shield electromagnetic radiation interference and avoid a high-voltage bypass effect, and has the characteristics of high temperature resistance, high light transmission, fast response, flexibility, thinness, suitability for micro-scale charge detonation pressure measurement and the like.
Owner:XI AN JIAOTONG UNIV

An integrated antenna housing for a Mars exploration and landing patrol device and its preparation method

The invention provides an integrated antenna shell for a Mars exploration landing rover and a preparation method of the integrated antenna shell. The integrated antenna shell is formed through the steps of shell molding mold manufacturing, carbon fiber / polyimide prepreg preparation, shell laying-up, imidization, curing, demolding, machining, metal plating on the inner surface of the shell and thelike. According to the integrated antenna shell for the Mars exploration landing rover, by the adoption of an auxiliary molding manner of a female and male combined mold and a high-temperature-resistant silicone rubber soft mold, one-time integrated molding of an autoclave molding process is adopted, and the prepared shell has the multi-function integrated characteristics of the light mass, resistance of the high temperature of 370 DEG C, space environment resistance and structure bearing; and meanwhile a coupling technology of a nanometer silver particle modified shell base body and an innersurface vacuum sputtering metallization layer is adopted, an electromagnetic shielding function of the antenna shell is achieved, the containing structure space occupied by a traditional antenna connecting cable is omitted, the interface connection is further reduced, and the structure manner of the shell is simplified while the space utilization rate is increased.
Owner:AEROSPACE RES INST OF MATERIAL & PROCESSING TECH +1

Electromagnetic shielding structure and manufacturing method of electromagnetic shielding structure

Embodiments of the present invention provide an electromagnetic shielding structure and a manufacturing method of the electromagnetic shielding structure, which relate to the technical field of semiconductor packaging. The electromagnetic shielding structure includes a substrate, a chip, a plastic package and a shielding layer; the chip is installed on the substrate, and the plastic package is arranged on the side of the substrate close to the chip; the substrate is provided with a grounding circuit. A grounding slot is provided inside the substrate, and a conductive layer is arranged in the grounding slot, and the conductive layer is connected to the grounding line of the substrate; the shielding layer is covered on the outer surface of the plastic package and connected to the conductive layer. The grounding groove is provided in the base plate for setting the conductive layer to connect with the shielding layer, so as to realize the electromagnetic shielding function. In this way, the short circuit between the conductive layer and the solder ball on the substrate can be avoided, the packaging efficiency can be improved, and the connection between the conductive layer and the shielding layer is more reliable, and the electromagnetic shielding effect is better.
Owner:FOREHOPE ELECTRONICS NINGBO CO LTD

Lightweight and high-strength electromagnetic shielding windshield and manufacturing method thereof

The invention relates to a piece of electromagnetic shielding glass and a manufacturing method thereof, specifically, to a piece of light high-intensity electromagnetic windshield glass with an electric heating function and a manufacturing method thereof. A metal grid structure is prepared on a flexible substrate to realize the electromagnetic shielding function; combination with the traditional electric heating glass manufacturing process is carried out to prepare a piece of light high-intensity electromagnetic shield glass. On the one hand, the intensity reduction caused by preparing a low-resistance transparent conductive film on a piece of load-bearing glass is avoided; and on the other hand, the conflict between the high shielding performance and the high light transmittance requirement of the traditional electromagnetic shielding glass is eliminated. The prepared electromagnetic shielding glass has the high light transmittance larger than or equal to 75%, the reduced weight withthe surface density less than or equal to 10kg / m<2>, and the high intensity; the total thickness does not exceed 6.0 mm and the shielding performance is larger than o equal to 40 dB(0.3-18 GHz). And the glass is resistant to the impact by a bird with the weight of 1.0kg at the speed less than or equal to 330km / h without any penetration and piece spatter.
Owner:AVIC BEIJING INST OF AERONAUTICAL MATERIALS

Electromagnetic shielding structure manufacturing process and electromagnetic shielding structure

ActiveCN112992707BRealize the grounding functionSteps to Avoid GroovingSemiconductor/solid-state device detailsSolid-state devicesElectrical connectionEngineering
The application provides an electromagnetic shielding structure manufacturing process and an electromagnetic shielding structure, which relate to the technical field of semiconductor packaging. The manufacturing process of the electromagnetic shielding structure includes forming a first bonding pad, a second bonding pad and a plurality of third bonding pads on the substrate, wherein the plurality of third bonding pads are arranged at intervals and surround the first bonding pad and the second bonding pad ; between the third pads, the first connection wires with grounding properties are arranged in a staggered distribution; the chip is mounted on the substrate; wherein, the chips are respectively electrically connected to the first pad and the second pad, and are located at the first connection online; form a plastic package on the substrate, and plant balls on the side of the substrate away from the plastic package; cut the plastic package and the substrate along the dicing line to form a single product; wherein, the dicing line is located on the third pad close to the chip side, so that the first connection line is exposed from the side of the plastic package after cutting; a metal layer is formed on the surface of the plastic package of a single product, so that the metal layer is electrically connected to the first connection line, and a good electromagnetic shielding effect is achieved.
Owner:FOREHOPE ELECTRONICS NINGBO CO LTD
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