Quasi-air tightness surface acoustic wave component encapsulation structure and manufacturing method

A surface acoustic wave, packaging structure technology, applied in the manufacture/assembly of electrical components, piezoelectric/electrostrictive devices, piezoelectric/electrostrictive/magnetostrictive devices, etc., can solve cutting difficulties and differences in expansion coefficients Larger, lowering the hardness, brittleness and brittleness of massage materials, etc., to reduce material costs, improve production efficiency, and avoid waste gas residues

Inactive Publication Date: 2018-11-02
张琴
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] 2) Cut the piezoelectric material wafer into a single surface acoustic wave element chip (the surface acoustic wave element is very similar to the bare chip of the integrated circuit at this time); due to the hard, brittle and fragile characteristics of the massage material, the piezoelectric wafer Very difficult to cut;
[0011] In this packaging structure, the price of the ceramic substrate used is high; the dimensional stability is poor (using high temperature sintering over 1000 degrees Celsius); in addition, it is difficult to cut. Of course, there is also a pre-split process now, which makes the ceramic substrate very easy to break during the packaging process.
[0012] The metal cover used in this structure is used for sealing and welding. Due to the large difference in expansion coefficient between metal and ceramics, in the high-temperature process of the packaging process, it is not possible to use a large-area one-time mounting and welding method, and only a single shielding can be used. Caps (mm size) are welded and mounted, limiting the throughput of the entire process

Method used

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  • Quasi-air tightness surface acoustic wave component encapsulation structure and manufacturing method
  • Quasi-air tightness surface acoustic wave component encapsulation structure and manufacturing method
  • Quasi-air tightness surface acoustic wave component encapsulation structure and manufacturing method

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Embodiment 1

[0062] Such as Figure 3 ~ Figure 7 As shown, this embodiment provides a quasi-hermetic surface acoustic wave component packaging structure, which includes a substrate array 1 , a shielding cover array 2 and five surface acoustic wave chips 3 .

[0063] The substrate array 1 has five substrates 11, and each substrate 11 corresponds to a surface acoustic wave chip 3, which is made of resin-glass fiber composite material, which can reduce the cost, improve the dimensional accuracy and process adaptability of the substrate 11, including The upper and lower surface circuits and through-holes, the substrate 11 is made by a general-purpose high density interconnect (High Density Interconnector, HDI) process, and because the resin has a certain degree of water absorption, the packaging structure of this embodiment is quasi-airtight .

[0064] The five surface acoustic wave chips 3 are all surface acoustic wave wafers, and are mounted on the substrate array 1. Specifically, each surf...

Embodiment 2

[0077] Such as Figure 12 to Figure 16 As shown, this embodiment provides a quasi-hermetic surface acoustic wave component packaging structure, which includes a substrate array 1 , a shielding cover array 2 and four surface acoustic wave chips 3 .

[0078] The substrate array 1 has four substrates 11, and each substrate 11 corresponds to a surface acoustic wave chip 3, which is made of resin-glass fiber composite material, which can reduce the cost, improve the dimensional accuracy and process adaptability of the substrate 11, including The upper and lower surface circuits and through-holes, the substrate 11 is made by a general-purpose high density interconnect (High Density Interconnector, HDI) process, and because the resin has a certain degree of water absorption, the packaging structure of this embodiment is quasi-airtight .

[0079] The four surface acoustic wave chips 3 are all surface acoustic wave wafers, and are mounted on the substrate array 1. Specifically, each s...

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Abstract

The invention discloses a quasi-air tightness surface acoustic wave component encapsulation structure and a manufacturing method. The encapsulation structure comprises a substrate array, a shielding cover array and multiple surface acoustic wave chips; and the multiple surface acoustic wave chips are attached to the substrate array, the shielding cover array is pressed to the substrate array at atime, multiple cavities are formed, multiple substrates of the substrate array, multiple shielding covers of the shielding cover array, the multiple cavities and the multiple surface acoustic wave chips correspond one to one, and each surface acoustic wave chip is located in the corresponding cavity. According to the encapsulation structure, encapsulation of a traditional surface acoustic wave component is simplified, the throughput of the process is greatly increased, and then the production efficiency is greatly improved.

Description

technical field [0001] The invention relates to a surface acoustic wave component packaging structure, in particular to a quasi-airtight surface acoustic wave component packaging structure and a manufacturing method, belonging to the field of surface acoustic wave component packaging. Background technique [0002] Surface Acoustic Wave (SAW, Surface Acoustic Wave) is an elastic wave that propagates along the surface of an object. Surface acoustic wave is a kind of sound wave whose energy is concentrated on the ground surface and propagated by the British physicist Rayleigh (Rayleigh). [0003] In 1965, R.M.White and F.W.Voltmer of the United States published a paper entitled "A New Type of Surface Acoustic Wave Acoustic-Electric Converter", which made metals that can excite surface acoustic waves on the surface of piezoelectric materials. Interdigital Transducer (IDT), realize the mutual conversion of sound waves and electromagnetic waves, see attached Figure 1 . [0004]...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L41/053H01L41/23
CPCH10N30/883H10N30/02
Inventor 张琴
Owner 张琴
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