Packaging body with electromagnetic shielding function and packaging process

A technology of electromagnetic shielding and packaging technology, applied in the direction of electric solid-state devices, circuits, electrical components, etc., can solve the problems that it is difficult to meet the needs of medium and high-frequency signal products in the communication field, and cannot realize the electromagnetic shielding function, so as to achieve strong anti-interference ability and improve quality effect

Active Publication Date: 2020-08-18
FOREHOPE ELECTRONICS NINGBO CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In the existing double-sided chip packaging structure and method, the electromagnetic shielding function cannot be realized, so it is difficult to meet the product requirements of high-frequency signals in the communication field

Method used

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  • Packaging body with electromagnetic shielding function and packaging process
  • Packaging body with electromagnetic shielding function and packaging process
  • Packaging body with electromagnetic shielding function and packaging process

Examples

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Embodiment Construction

[0044] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments It is a part of embodiments of the present invention, but not all embodiments. The components of the embodiments of the invention generally described and illustrated in the figures herein may be arranged and designed in a variety of different configurations.

[0045] Accordingly, the following detailed description of the embodiments of the invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely represents selected embodiments of the invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art wi...

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Abstract

The invention provides a packaging body with an electromagnetic shielding function and a packaging process, and relates to the field of electronic products. The packaging body comprises a packaging substrate, a first chip, a second chip, a first plastic packaging piece, a second plastic packaging piece and a shielding layer. The packaging substrate comprises a first mounting surface and a second mounting surface which are oppositely arranged; the first chip is arranged on the first mounting surface, and the second chip is arranged on the second mounting surface; the first plastic package pieceis arranged on the first mounting surface to package the first chip in a plastic mode; and the second plastic package piece is arranged on the second mounting surface to package the second chip in aplastic mode. The first mounting surface is provided with at least one grounding bonding pad, and the second mounting surface is provided with a ball mounting bonding pad; and the shielding layer covers the first plastic package piece and the package substrate; and the grounding bonding pad is connected with the shielding layer, so that a good electromagnetic shielding function can be realized, and the product requirements for high-frequency signals in the communication field are met.

Description

technical field [0001] The invention relates to the field of electronic products, in particular to a packaging body with an electromagnetic shielding function and a packaging process. Background technique [0002] In the field of electronic devices, there are many integrated circuit chips (Integrated Circuit, IC for short) that are sensitive to electromagnetic interference, such as radio frequency chips, especially high frequency radio frequency chips. These chips must be electromagnetically shielded before work, otherwise It is difficult to work normally due to electromagnetic interference. [0003] With the rapid development of the semiconductor industry, the miniaturization of electronic products is getting higher and higher density, more and more functions, and the product size is getting smaller and smaller. Therefore, the double-sided chip packaging structure is widely used in the semiconductor industry. It encapsulates chips with different functions on both sides (fr...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L25/18H01L21/56H01L23/31H01L23/552H01L25/065
CPCH01L25/0657H01L25/18H01L23/3107H01L23/552H01L21/56H01L2224/48091H01L2924/00014
Inventor 何正鸿李立兵
Owner FOREHOPE ELECTRONICS NINGBO CO LTD
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