Electromagnetic shielding structure and manufacturing method of electromagnetic shielding structure

Abstract

Embodiments of the present invention provide an electromagnetic shielding structure and a manufacturing method of the electromagnetic shielding structure, which relate to the technical field of semiconductor packaging. The electromagnetic shielding structure includes a substrate, a chip, a plastic package and a shielding layer; the chip is installed on the substrate, and the plastic package is arranged on the side of the substrate close to the chip; the substrate is provided with a grounding circuit. A grounding slot is provided inside the substrate, and a conductive layer is arranged in the grounding slot, and the conductive layer is connected to the grounding line of the substrate; the shielding layer is covered on the outer surface of the plastic package and connected to the conductive layer. The grounding groove is provided in the base plate for setting the conductive layer to connect with the shielding layer, so as to realize the electromagnetic shielding function. In this way, the short circuit between the conductive layer and the solder ball on the substrate can be avoided, the packaging efficiency can be improved, and the connection between the conductive layer and the shielding layer is more reliable, and the electromagnetic shielding effect is better.

Description

technical field [0001] The invention relates to the technical field of semiconductor packaging, in particular to an electromagnetic shielding structure and a manufacturing method of the electromagnetic shielding structure. Background technique [0002] With the rapid development of the semiconductor industry, a System In a Package (SIP) module structure is widely used in the semiconductor industry. System-in-Package can package and stack chips with different functions. The main advantages are high-density integration, small size of packaged products, superior product performance, and fast signal transmission frequency. As electronic products are used in high-frequency signals in the communication field, electronic products are required to have an electromagnetic shielding structure to prevent electromagnetic interference between various chips and components. [0003] The existing SIP module electromagnetic shielding technology mainly uses a single metal sputtering process, ...

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Problems solved by technology

[0003] The existing SIP module electromagnetic shielding technology mainly uses a single metal sputtering process, which requires metal sputtering after a single product substrate is planted with a film on the back of the ball. Due to the height of the solder ball, the sealing of the substrate back film is not good. During the metal sputtering process, the metal easily enters the ball-planting surface of the substrate, causing a short circuit between the solder ball and the metal layer, resulting in a loss of product yield

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